Touch panel member, touch panel, and touch panel display device

ABSTRACT

The object of the present invention is to provide a touch panel member that is excellent in terms of suppression of visibility of a transparent electrode and has low total reflection for visible light, and a touch panel and a touch panel display device having the touch panel member. 
     The touch panel member of the present invention comprises, in order, at least a transparent substrate, a transparent electrode, and a protective layer provided so as to cover the transparent electrode, the protective layer comprising three or more layers having different refractive indices, all of the different refractive index layers of the protective layer satisfying a specific expression, and the protective layer satisfying another specific expression.

CROSS-REFERENCE TO RELATED APPLICATION

The present application claims a Paris Convention priority to JapanesePatent Application No. 2015-057444 filed on Mar. 20, 2015. The contentsof the basic application are incorporated herein by reference in theirentirety.

TECHNICAL FIELD

The present invention relates to a touch panel member, a touch panel,and a touch panel display device.

BACKGROUND ART

Flat panel displays such as liquid crystal display devices and organicEL display devices are widely used. Furthermore, in recent years,accompanying the widespread use of smart phones and tablet terminals,capacitance type touch panels have been attracting attention. A sensorsubstrate of a capacitance type touch panel usually has a structure inwhich wiring is formed by patterning ITO (Indium Tin Oxide) or a metal(silver, molybdenum, aluminum, etc.) on glass; in addition, anintersection of the wiring has an insulating film, and there is aprotective film for protecting the ITO and the metal.

As a conventional touch panel, those described in published Japanesetranslation 2013-532868 of a PCT application, JP-A-2010-137447 (JP-Adenotes a Japanese unexamined patent application publication) andJP-A-2014-85612 are known.

SUMMARY OF THE INVENTION Problems to be Solved by the Invention

It is an object of the present invention to provide a touch panel memberthat is excellent in terms of suppression of visibility of a transparentelectrode and has low total reflection for visible light, and a touchpanel and a touch panel display device having the touch panel member.

Means for Solving the Problems

The object of the present invention has been accomplished by meansdescribed in <1>, <11>, or <12> below. They are described below togetherwith <2> to <10>, which are preferred embodiments.

-   <1> A touch panel member comprising, in order, at least a    transparent substrate, a transparent electrode, and a protective    layer provided so as to cover the transparent electrode, the    protective layer comprising three or more layers having different    refractive indices, all of the different refractive index layers of    the protective layer satisfying Expression 1, and the protective    layer satisfying Expression 2 and Expression 3 below,

0<n(x)−n(x+1)≦0.20   (1)

|n(electrode)−n(1)|≦0.20   (2)

0.20≦n(1)−n(N)   (3)

wherein in the expressions, among the different refractive index layersin the protective layer, the layer that is closest to the transparentelectrode is designated as the 1st layer, then the 2nd layer, and so on,and the layer that is farthest from the transparent substrate isdesignated as the Nth layer, the refractive index of an ath layer of theprotective layer is defined as n(a), a denotes an integer satisfying1≦a≦N, x denotes an integer satisfying 1≦x≦N−1, and the refractive indexof the transparent electrode is defined as n(electrode),

-   <2> The touch panel member according to <1>, wherein the face of the    transparent substrate on which the transparent electrode is provided    and the side face of the transparent electrode form a taper angle of    2° to 80°,-   <3> the touch panel member according to <1> or <2>, wherein the    transparent electrode has a refractive index of at least 1.76 but no    greater than 2.30,-   <4> the touch panel member according to <3>, wherein the transparent    electrode has a refractive index of at least 1.86 but no greater    than 2.20,-   <5> the touch panel member according to any one of <1> to <4>,    wherein the transparent electrode comprises indium tin oxide or    indium zinc oxide,-   <6> the touch panel member according to any one of <1> to <5>,    wherein all of the 1st layer to the N-1th layer in the protective    layer are layers comprising an inorganic material and an organic    material,-   <7> the touch panel member according to any one of <1> to <6>,    wherein all of the 1st layer to the Nth layer in the protective    layer comprise a polymer,-   <8> the touch panel member according to any one of <1> to <7>,    wherein all of the 1st layer to the N-1th layer in the protective    layer are layers comprising a compound selected from the group    consisting of a titanoxane, a zirconoxane, a titanoxane-zirconoxane    condensation product, titanium oxide, zirconium oxide, and a    titanium-zirconium composite oxide,-   <9> the touch panel member according to <8>, wherein with regard to    the 1st layer to the N-1th layer in the protective layer, the    content of the compound selected from the group consisting of a    titanoxane, a zirconoxane, a titanoxane-zirconoxane condensation    product, titanium oxide, zirconium oxide, and a titanium-zirconium    composite oxide decreases as the layer number increases,-   <10> the touch panel member according to <8> or <9>, wherein all of    the 1st layer to the N-1th layer in the protective layer are layers    comprising titanium oxide particles, zirconium oxide particles,    and/or titanium-zirconium composite oxide particles,-   <11> a touch panel comprising the touch panel member according to    any one of <1> to <10>, and-   <12> a touch panel display device comprising the touch panel member    according to any one of <1> to <10>.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1: A conceptual sectional view showing one example of the touchpanel member of the present invention.

EXPLANATION OF REFERENCE NUMERALS AND SYMBOLS

10: touch panel member, 12: transparent substrate, 14: transparentelectrode, 16: protective layer, 16 a: 1st layer of protective layer, 16b: 2nd layer of protective layer, 16 c: 3rd layer (Nth layer) ofprotective layer

MODES FOR CARRYING OUT THE INVENTION

The content of the present invention is explained in detail below. Theexplanation of the constituent features given below is based onrepresentative embodiments of the present invention, but the presentinvention should not be construed as being limited to such embodiments.In the present specification, ‘to’ is used to mean that the numericalvalues given before and after it are included as a lower limit value andan upper limit value. Furthermore, an organic EL device in the presentinvention means an organic electroluminescence device.

With regard to the notation of a group (atomic group) in the presentspecification, a notation that does not indicate whether it issubstituted or unsubstituted includes one without a substituent as wellas one with a substituent. For example, an ‘alkyl group’ includes analkyl group without a substituent (unsubstituted alkyl group) as well asan alkyl group with a substituent (substituted alkyl group).

Furthermore, a chemical structural formula in the present specificationmight be given using a simplified structural formula in which hydrogenatoms are omitted.

In addition, in the present specification, “(meth)acrylate” denotesacrylate and methacrylate, “(meth)acrylic” denotes acrylic andmethacrylic, and “(meth)acryloyl” denotes acryloyl and methacryloyl.

In the present invention, ‘at least one type selected from the groupconsisting of a1 to a3’, etc. is also called simply ‘Component A’, etc.

Furthermore, in the present invention, ‘mass %’ and ‘wt %’ have the samemeaning, and ‘parts by mass’ and ‘parts by weight’ have the samemeaning.

Moreover, in the present invention, a combination of two or morepreferred embodiments is a more preferred embodiment.

The weight-average molecular weight and number-average molecular weightof a resin, a titanoxane, a zirconoxane, and a titanoxane-zirconoxanecondensation product in the present invention are measured using a gelpermeation chromatography (GPC) method.

(Touch Panel Member)

The touch panel member of the present invention comprises, in order, atleast a transparent substrate, a transparent electrode, and a protectivelayer provided so as to cover the transparent electrode, the protectivelayer comprising three or more layers having different refractiveindices, all of the different refractive index layers of the protectivelayer satisfying Expression 1, and the protective layer satisfyingExpression 2 and Expression 3 below.

0<n(x)−n(x+1)≦0.20   (1)

|n(electrode)−n(1)|≦0.20   (2)

0.20≦n(1)−n(N)   (3)

In the expressions, among the different refractive index layers in theprotective layer, the layer that is closest to the transparent electrodeis designated as the 1st layer, then the 2nd layer, and so on, and thelayer that is farthest from the transparent substrate is designated asthe Nth layer, the refractive index of an ath layer of the protectivelayer is defined as n(a), a denotes an integer satisfying 1≦a≦N, xdenotes an integer satisfying 1≦x≦N−1, and the refractive index of thetransparent electrode is defined as n(electrode).

The refractive index in the present invention is the refractive indexfor light at a wavelength of 550 nm at 25° C. unless otherwisespecified.

With regard to a method for measuring refractive index, it may bemeasured using an ellipsometer under conditions of a measurementtemperature of 25° C. and a measurement wavelength of 550 nm.

As a method for measuring the refractive index of a layered bodycomprising a plurality of layers having different refractive indices,either of (1) a method in which the refractive index of each layer isindividually measured or (2) a method in which the refractive index ofthe layered body comprising a plurality of layers is measuredspectroscopically may be employed. When the method (2) in which therefractive index of the layered body comprising a plurality of layers ismeasured spectroscopically is carried out, a change in the refractiveindex of each layer may be estimated based on observation of across-section using an electron microscope, and a suitable optical modelmay be selected and fitted. Furthermore, measurement may be carried outby a spectroscopic ellipsometry method based on the fitting.

Conventional touch panel members and touch panels have the problems ofvisibility of a touch panel electrode and reflectance of the touchpanel.

With regard to the reflectance of a touch panel, when the reflectance ishigh, external light is reflected to a greater extent, and the displayis more difficult to see outdoors, etc.

Furthermore, there are two types of visibility of a touch panelelectrode, one thereof is the visibility (framework visibility) of anelectrode due to a difference in refractive index between a transparentelectrode (for example, ITO: refractive index 1.90) and a transparentsubstrate as a base (for example, glass: refractive index 1.5,polyethylene terephthalate (PET): refractive index 1.5), and the otheris the visibility (taper visibility) of an electrode due to thereflection of light from a taper part, which is a side face portion of atransparent electrode.

Now, as a result of an intensive investigation by the present inventors,it has been found that a touch panel member that is excellent in term ofsuppression of visibility (suppression of framework visibility andsuppression of taper visibility) of a transparent electrode and has lowtotal reflection of visible light can be obtained by forming aprotective layer for a transparent electrode from three or more layershaving different refractive indices and setting the refractive index ofeach layer within a specific range, and the present invention has thusbeen accomplished.

<Protective Layer>

The touch panel member of the present invention comprises a protectivelayer provided so as to cover a transparent electrode, the protectivelayer comprising three or more layers having different refractiveindices, all of the different refractive index layers of the protectivelayer satisfying Expression 1, and the protective layer satisfyingExpression 2 and Expression 3 below.

0<n(x)−n(x+1)≦0.20   (1)

|n(electrode)−n(1)|≦0.20   (2)

0.20≦n(1)−n(N)   (3)

In the expressions, among the different refractive index layers in theprotective layer, the layer that is closest to the transparent electrodeis designated as the 1st layer, then the 2nd layer, and so on, and thelayer that is farthest from the transparent substrate is designated asthe Nth layer, the refractive index of an ath layer of the protectivelayer is defined as n(a), a denotes an integer satisfying 1≦a≦N, xdenotes an integer satisfying 1≦x≦N−1, and the refractive index of thetransparent electrode is defined as n(electrode).

The protective layer in the touch panel member of the present inventioncomprises three or more layers having different refractive indices andis provided so as to cover a transparent electrode.

The transparent electrode may be formed on a transparent substrate, asdesired, in any wiring pattern shape, and in many cases itscross-sectional shape is a trapezoidal shape that is wider on thetransparent substrate side.

The protective layer may be provided so as to cover at least part of thetransparent electrode formed into the wiring pattern shape.

Furthermore, the shape of the face on the Nth layer side (the sideopposite to the transparent substrate side) of the protective layer maybe flat, one that reflects the shape of the transparent electrode, or asdesired one having any asperities, etc., but from the viewpoint ofprevention of framework visibility and planarization, it preferably hasa flat face shape, and more preferably a flat face shape that has avariation in height from the transparent substrate to the face on theNth layer side of the protective layer of no greater than 0.1 μm.

Moreover, it is preferable that the pencil hardness of the Nth layer ofthe protective layer is a hardness of B or higher, and it is morepreferable that the pencil hardness of the protective layer overall andeach of the different refractive index layers of the protective layerhave a hardness of B or higher.

The pencil hardness is measured in accordance with JIS K5600-5-4 using aUni manufactured by Mitsubishi Pencil Co., Ltd. under conditions of aload of 750 gw, an angle of 45°, a speed of 0.1 cm/sec, and atemperature of 25° C.

The number of layers of the protective layer is not particularly limitedas long as it is 3 or greater. From the viewpoint of ease of production,the number of layers of the protective layer is preferably 3 to 10layers, more preferably 3 to 5 layers, and particularly preferably 3 or4 layers.

From the viewpoint of prevention of framework visibility andplanarization, the total film thickness of the protective layer ispreferably 0.04 to 10 μm, more preferably 0.5 to 6.0 μm, andparticularly preferably 1.0 to 5.0 μm.

From the viewpoint of flatness and film thickness stability, the filmthickness of each of the different refractive index layers of theprotective layer is preferably 0.02 to 5 μm, more preferably 0.3 to 4.0μm, and particularly preferably 0.5 to 2.0 μm.

Furthermore, when each of the layers of the protective layer comprisesonly an inorganic material, the film thickness of each layer ispreferably 0.02 to 1.0 μm, preferably 0.03 to 0.6 μm, and particularlypreferably 0.04 to 0.5 μm.

When each of the layers in the protective layer comprises an organicmaterial, the film thickness of each layer is preferably 0.4 to 5 μm,more preferably 0.5 to 4.0 μm, and particularly preferably 0.6 to 2.0μm.

The protective layer is preferably transparent.

Furthermore, the overall transmittance of the protective layer for lighthaving a wavelength of 400 nm is preferably at least 80%, morepreferably at least 85%, and particularly preferably at least 90%.

All of the different refractive index layers of the protective layer inthe touch panel member of the present invention satisfy Expression 1.

0<n(x)−n(x+1)≦0.20   (1)

Expression 1 represents the difference in refractive index betweenadjacent layers within the protective layer and shows that the closer tothe transparent electrode side, the higher the refractive index.

For example, when the number of layers of the protective layer is 3layers, the protective layer of the touch panel member of the presentinvention satisfies the two expressions 0<n(1)−n(2)≦0.20 and0<n(2)−n(3)≦0.20.

As shown in Expression 1 above, the difference in refractive indexbetween adjacent layers is greater than 0 but no greater than 0.2, morepreferably greater than 0 but no greater than 0.15 from the viewpoint ofprevention of total reflection, and particularly preferably greater than0 but no greater than 0.10.

The protective layer in the touch panel member of the present inventionsatisfies Expression 2.

|n(electrode)−n(1)|≦0.20   (2)

Expression 2 represents the absolute value of the difference inrefractive index between the 1st layer in the protective layer and thetransparent electrode.

The absolute value of the difference in refractive index between the 1stlayer and the transparent electrode is no greater than 0.2, preferablyno greater than 0.15 from the viewpoint of prevention of totalreflection, prevention of framework visibility, and prevention of tapervisibility, and more preferably no greater than 0.10.

From the viewpoint of production suitability, Expression 2 is preferably0≦n(electrode)−n(1)≦0.2. That is, the refractive index of the 1st layerin the protective layer is preferably the same as or smaller than therefractive index of the transparent electrode.

The protective layer of the touch panel member of the present inventionsatisfies Expression 3.

0.20≦n(1)−n(N)   (3)

Expression 3 represents the difference in refractive index between the1st layer and the Nth layer of the protective layer, that is, thedifference in refractive index between the outermost layer on thetransparent substrate side of the protective layer and the outermostlayer, on the side opposite to the transparent substrate, of theprotective layer.

The difference in refractive index between the 1st layer and the Nthlayer is 0.2 or greater, preferably 0.25 or greater from the viewpointof prevention of total reflection, prevention of framework visibility,and prevention of taper visibility, and more preferably 0.3 or greater.

An upper limit is not defined for the difference in refractive indexbetween the 1st layer and the Nth layer, but from the viewpoint ofprevention of total reflection, prevention of framework visibility, andprevention of taper visibility, where there is an adjacent layer that isin contact with the Nth layer, the upper limit is preferably|n(electrode)−n(adjacent)| where the refractive index of the adjacentlayer is n(adjacent). Furthermore, from the viewpoint of ease ofproduction, the upper limit is preferably no greater than 0.70, and morepreferably no greater than 0.60.

Furthermore, in the touch panel member of the present invention, whenthere is an adjacent layer that is in contact with the Nth layer of theprotective layer, it is preferable that Expression 4 below is satisfied.

|n(N)−n(adjacent)|≦0.2   (4)

In the expression, n(adjacent) denotes the refractive index of theadjacent layer.

Expression 4 represents the absolute value of the difference inrefractive index between the Nth layer of the protective layer and theadjacent layer that is in contact with the Nth layer.

From the viewpoint of prevention of total reflection, the absolute valueof the difference in refractive index between the adjacent layer and theNth layer is preferably no greater than 0.2, more preferably no greaterthan 0.15, and particularly preferably no greater than 0.10.

Moreover, from the viewpoint of production suitability, Expression 4 ispreferably 0≦n(N)−n(adjacent)≦0.2.

The protective layer in the touch panel member of the present inventioncomprises three or more layers having different refractive indices, allof the different refractive index layers of the protective layer satisfyExpression 1 above and, furthermore, with regard to the protectivelayer, the material and the formation method for the protective layerare not particularly limited as long as Expression 2 and Expression 3above are satisfied.

Each of the different refractive index layers in the protective layer isnot limited in terms of material and production method as long as alayer having a predetermined refractive index can be formed. It may bean organic material, an inorganic material, or an organic/inorganicmixed material.

Furthermore, as a method for forming each of the different refractiveindex layers of the protective layer, each layer may be formed insequence by a coating method, a sputtering method, a vapor depositionmethod, etc., two or more layers may be formed simultaneously by amultilayer coating method, or they may be formed by transfer using atransfer material.

The material for each of the different refractive index layers in theprotective layer is not particularly limited, and each layer of theprotective layer may be formed using a composition comprising a polymer,a refractive index-adjusting agent, a crosslinking agent, aphotosensitizing agent, and/or another additive.

From the viewpoint of ease of adjustment of physical properties andformation of a layer, each layer in the protective layer preferablycomprises a polymer.

Moreover, the 1st layer to the N-1th layer in the protective layerpreferably comprise a refractive index-adjusting agent.

Furthermore, with regard to the 1st layer to the N-1th layer in theprotective layer, it is preferable that the content of the refractiveindex-adjusting agent decreases as the layer number increases.

All of the 1st layer to the N-1th layer in the protective layer arepreferably layers comprising an inorganic material and an organicmaterial, more preferably layers comprising an inorganic material and apolymer, particularly preferably layers comprising an inorganic materialand/or a metal alkoxide condensation product and a polymer, particularlypreferably layers comprising inorganic particles and/or a metal alkoxidecondensation product and a polymer, and most preferably layerscomprising titanium oxide particles, zirconium oxide particles, and/ortitanium-zirconium composite oxide particles and a polymer. With thisembodiment, layer formation is easy, and film physical properties areexcellent.

The inorganic material and/or the metal alkoxide condensation productare preferably a metal oxide and/or a metal alkoxide condensationproduct, and more preferably titanium oxide, zirconium oxide, atitanium-zirconium composite oxide, a titanoxane, a zirconoxane, and/ora titanoxane-zirconoxane condensation product.

Polymer

The polymer that can be used in the present invention is notparticularly limited; a known resin that is used in a resist or a curedmaterial thereof may preferably be used, and an acrylic polymer, asiloxane-based polymer, a polybenzoxazole-based polymer, apolyimide-based polymer, an alicyclic olefin-based polymer, etc. maydesirably be used.

With regard to the polymer, one type may be used on its own or two ormore types may be used in combination.

The polymer in the protective layer is preferably a polymer obtained bycuring a composition for formation of a protective layer, which isdescribed later.

The acrylic polymer may be a polymer formed by polymerization using a(meth)acrylic compound at 50 mole % or greater of total monomers; aknown acrylic polymer may be used, and examples include a polymer havinga constituent unit having an acid group protected with anacid-decomposable group, which is described later, an alkali solubleresin, and a resin formed by curing the above.

The siloxane-based polymer is not particularly limited, and a knownsiloxane-based polymer may be used.

Examples of the siloxane-based polymer include a polysiloxane formed bya synthesis involving hydrolysis-condensation of one or more types oforganosilane represented by Formula S-1 and/or one or more types oforganosilane represented by Formula S-2.

With regard to the organosilane represented by Formula S-1, the R^(S1)sindependently denote a hydrogen atom, an alkyl group having 1 to 10carbons, an alkenyl group having 2 to 10 carbons, or an aryl grouphaving 6 to 15 carbons, and the plurality of R^(S1)s may be identical toor different from each other. Any of the alkyl group, alkenyl group, andaryl group may be either unsubstituted or substituted, and may beselected according to the properties of the composition.

The R^(S2)s in Formula S-1 independently denote a hydrogen atom, analkyl group having 1 to 6 carbons, an acyl group having 2 to 6 carbons,or an aryl group having 6 to 15 carbons, and the plurality of R^(S2)smay be identical to or different from each other. Furthermore, any ofthe alkyl group, acyl group, and aryl group may be either unsubstitutedor substituted, and may be selected according to the properties of thecomposition.

p in Formula S-1 denotes an integer of 1 to 3.

With regard to the organosilane represented by Formula S-2, R^(S3) toR^(S6) independently denote a hydrogen atom, an alkyl group having 1 to6 carbons, an acyl group having 2 to 6 carbons, or an aryl group having6 to 15 carbons. Any of the alkyl group, acyl group, and aryl group maybe either unsubstituted or substituted, and may be selected according tothe properties of the composition. Specific examples of the alkyl groupinclude a methyl group, an ethyl group, an n-propyl group, an isopropylgroup, and an n-butyl group. Specific examples of the acyl group includean acetyl group. Specific examples of the aryl group include a phenylgroup.

q in Formula S-2 denotes an integer of 1 to 8.

As the siloxane-based polymer, a polysiloxane described in paragraphs0044 to 0058 of International Laid-open Patent No. 2012/029734, apolysiloxane described in paragraphs 0022 to 0082 of InternationalLaid-open Patent No. 2012/127964, and a polysiloxane described inparagraphs 0043 to 0117 of JP-A-2014-115438 may be used.

The polybenzoxazole-based polymer is not particularly limited, and aknown polybenzoxazole-based polymer may be used.

As the polybenzoxazole-based polymer, a polybenzoxazole precursorcomprising a constituent unit represented by Formula Z-1 below and aring-closed derivative thereof may be used.

X^(z) denotes a tetravalent organic group, Y^(z) denotes a divalentorganic group, and the R^(z)s independently denote a hydrogen atom, analkyl group, a group protected by an acetal structure, or a grouprepresented by —COR^(c). R^(c) denotes an alkyl group or an aryl group.

The tetravalent organic group denoted by X^(z) is preferably atetravalent aliphatic hydrocarbon group, a tetravalent aromatichydrocarbon group, or a group formed by bonding two or more structuresselected from the group consisting of a di- or higher-valent aliphatichydrocarbon group, a di- or higher-valent aromatic hydrocarbon group,—O—, —S—, —SO₂—, —CO—, and —NHCO—. These groups may optionally have asubstituent such as a halogen atom.

The number of carbons of X^(z) is preferably 6 to 50, and morepreferably 6 to 30

X^(z) is preferably a tetravalent organic group having at least anaromatic ring.

The divalent organic group denoted by Y^(z) is preferably a divalentaliphatic hydrocarbon group, a divalent aromatic hydrocarbon group, or agroup formed by bonding two or more structures selected from the groupconsisting of a divalent aliphatic hydrocarbon group, a divalentaromatic hydrocarbon group, —O—, —S—, —SO₂—, —CO—, and —NHCO—. Thesegroups may optionally have a substituent such as a halogen atom.

The number of carbons of Y^(z) is preferably 2 to 50, and morepreferably 3 to 20.

Y^(z) is preferably a divalent aliphatic hydrocarbon group.

As the polybenzoxazole-based polymer, a polymer described in paragraphs0014 to 0064 of JP-A-2008-224970 may be used.

Furthermore, the polybenzoxazole precursor is preferably a compoundhaving a constituent repeating unit represented by Formula Z-1-1 belowand a constituent repeating unit represented by Formula Z-1-2 below, andmore preferably a compound having 50 mass % or greater of a constituentrepeating unit represented by Formula Z-1-1 below and a constituentrepeating unit represented by Formula Z-1-2 below.

In Formula Z-1-1 and Formula Z-1-2, X^(z1) and X^(z2) independentlydenote a tetravalent organic group, R^(z1) to R^(z4) independentlydenote a hydrogen atom, an alkyl group, an acid-decomposable group, or agroup represented by —CORc, at least one of R^(z1) to R^(z4) denotes ahydrogen atom or an acid-decomposable group, Rc denotes an alkyl groupor an aryl group, Y^(z1) denotes a straight-chain or branched divalentaliphatic hydrocarbon group having 3 to 15 carbons, and Y^(z2) denotes acyclic divalent aliphatic hydrocarbon group having 4 to 20 carbons.

Preferred embodiments of X^(z1) and X^(z2) in Formula Z-1-1 and FormulaZ-1-2 are independently the same as preferred embodiments of X^(z) inFormula Z-1.

Preferred examples of Y^(z1) include a propylene group, a butylenegroup, a hexylene group, and an octylene group.

Preferred examples of Y^(z2) include a cyclohexylene group and anadamantylene group.

X^(z1) and X^(z2) are preferably independently a group represented byany of Formula X-1 to Formula X-4 below.

In Formula X-1 to Formula X-4, either one of *1 and *2 denotes aposition bonded to —OR^(z1) or —OR^(z3), the other denoting a positionbonded to a polymer main chain, and either one of *3 and *4 denotes aposition bonded to —OR^(z2) or —OR^(z4), the other denoting a positionbonded to a polymer main chain.

In the polybenzoxazole precursor, the ratio of the constituent repeatingunit represented by Formula Z-1-1 and the constituent repeating unitrepresented by Formula Z-1-2 is preferably 9:1 to 3:7 as a molar ratio.

The polymer may be for example a composition itself for formation of aprotective layer, which is described later, one that has been dried, orone that has been cured and thermally treated, but is preferably a resinformed by curing a composition for formation of a protective layer,which is described later, and more preferably a resin formed by curingand further thermally treating a composition for formation of aprotective layer, which is described later.

The content of the polymer in the protective layer or in each layer ofthe protective layer is preferably 20 to 85 mass %, more preferably 30to 80 mass %, and yet more preferably 35 to 60 mass %. When in thisrange, the transparency and strength are excellent.

Furthermore, when a condensation product of a metal alkoxide compoundsuch as a titanoxane, a zirconoxane, and/or a titanoxane-zirconoxanecondensation product, which are described later, and/or inorganicparticles are contained, the total content of the metal alkoxidecompound condensation product, inorganic particles, and polymer in theprotective layer or in each layer of the protective layer is preferably20 to 100 mass %, more preferably 30 to 100 mass %, and yet morepreferably 35 to 100 mass %. When in this range, the transparency andstrength are excellent.

Refractive Index-Adjusting Agent

All of the 1st layer to the N-1th layer in the protective layerpreferably comprise a refractive index-adjusting agent.

Furthermore, the Nth layer in the protective layer may comprise arefractive index-adjusting agent.

The refractive index-adjusting agent is not particularly limited, andmay be an inorganic compound or an organic compound, but is preferablyan inorganic oxide and/or a condensation product of a metal alkoxidecompound, more preferably a metal oxide and/or a condensation product ofa metal alkoxide compound, and particularly preferably metal oxideparticles and/or a condensation product of a metal alkoxide compound.

Moreover, preferred examples of the refractive index-adjusting agentinclude a fluorene compound, which is described later.

The inorganic oxide and/or the condensation product of a metal alkoxidecompound are preferably compounds selected from the group consisting ofa titanoxane, a zirconoxane, a titanoxane-zirconoxane condensationproduct, titanium oxide, zirconium oxide, and a titanium-zirconiumcomposite oxide, and more preferably compounds selected from the groupconsisting of a titanoxane, a zirconoxane, a titanoxane-zirconoxanecondensation product, titanium oxide particles, zirconium oxideparticles, and titanium-zirconium composite oxide particles.

The condensation product of a metal alkoxide compound is preferably acondensation product formed from a composition comprising a1 and/or a2below.

Furthermore, the inorganic oxide is preferably a3 below.

a1: alkoxy group-containing titanium compound and/or zirconium compound,

a2: titanoxane, zirconoxane and/or titanoxane-zirconoxane condensationproduct comprising at least one alkoxy group directly bonded to titaniumatom or zirconium atom,

a3: titanium atom- and/or zirconium atom-containing metal oxide.

Each layer of the protective layer may comprise one type of refractiveindex-adjusting agent on its own or may comprise two or more types.

When each layer of the protective layer comprises a1 above, itpreferably simultaneously comprises a component corresponding to a2 thatis a condensate of said al.

Among them, each of the 1st layer to the N-1 th layer in the protectivelayer preferably comprises a3, more preferably comprises titanium oxideparticles, zirconium oxide particles, and/or titanium atom- and/orzirconium atom-containing composite oxide particles, and yet morepreferably comprises titanium oxide particles. With this embodiment, thetransmittance is higher, and the crack resistance is better.

The content (mass content) of the refractive index-adjusting agent, inparticular a1 to a3, in the 1st layer to the N-1th layer is preferably0.1 to 80 mass %, more preferably 0.5 to 70 mass %, and yet morepreferably 1 to 65 mass %. When in this range, the transparency andstrength are excellent.

It is preferable that the content of a1 to a3 decreases as the layernumber of the 1st layer to the N-1th layer in the protective layerincreases, and it is more preferable that the content of a3 decreases asthe layer number increases. With this embodiment, adjustment of therefractive index of each layer is easy. The increase in layer numberreferred to here means that it goes from the 1st layer to the 2nd layer,the 3rd layer, and a layer that is farther from the transparentelectrode side among the respective layers of the protective layer.

a1 to a3 is preferably selected from the group consisting of a titaniumcompound, a titanoxane, and titanium oxide from the viewpoint of costand refractive index, or is preferably selected from the groupconsisting of a zirconium compound, a zirconoxane, and zirconium oxidefrom the viewpoint of low temperature curability, cure rate, andstability.

a1: Alkoxy Group-Containing Titanium Compound and/or Zirconium Compound

Examples of a1: alkoxy group-containing titanium compound and alkoxygroup-containing zirconium compound include a titanium monoalkoxide, atitanium dialkoxide, a titanium trialkoxide, a titanium tetraalkoxide, azirconium monoalkoxide, a zirconium dialkoxide, a zirconium trialkoxide,and a zirconium tetraalkoxide. Among them a titanium tetraalkoxide and azirconium tetraalkoxide are preferable.

The titanium tetraalkoxide is preferably a titanium tetraalkoxiderepresented by Formula a1-1 below from the viewpoint of film physicalproperties.

The zirconium tetraalkoxide is preferably a zirconium tetraalkoxiderepresented by Formula a1-2 below from the viewpoint of film physicalproperties.

In Formula a1-1 and Formula a1-2, R¹ to R⁴ independently denote an alkylgroup having 1 to 18 carbons, an aryl group having 6 to 18 carbons, oran aralkyl group having 7 to 18 carbons.

Examples of the titanium tetraalkoxide represented by Formula a1-1include titanium tetramethoxide, titanium tetraethoxide, titaniumtetra-n-propoxide, titanium tetraisopropoxide, titaniumtetra-n-butoxide, titanium tetraisobutoxide, titaniumdiisopropoxydi-n-butoxide, titanium di-t-butoxydiisopropoxide, titaniumtetra-t-butoxide, titanium tetraisooctyloxide, and a titaniumtetrastearylalkoxide.

Specific examples of the zirconium tetraalkoxide represented by Formulaa1-2 include, but are not limited to, zirconium tetramethoxide,zirconium tetraethoxide, zirconium tetra-n-propoxide, zirconiumtetraisopropoxide, zirconium tetra-n-butoxide, zirconiumtetraisobutoxide, zirconium diisopropoxydi-n-butoxide, zirconiumdi-t-butoxydiisopropoxide, zirconium tetra-t-butoxide, zirconiumtetraisooctyloxide, and a zirconium tetrastearylalkoxide.

a2: Titanoxane, Zirconoxane, and/or Titanoxane-Zirconoxane CondensationProduct having at least One alkoxy Group Directly Connected to TitaniumAtom or Zirconium Atom

The titanoxane is also called a polytitanoxane and is a compound havingtwo or more Ti—O—Ti bonds.

The zirconoxane is also called a polyzirconoxane and is a compoundhaving two or more Zr—O—Zr bonds.

The titanoxane is preferably a titanoxane represented by Formula a2-1below from the viewpoint of film physical properties.

Furthermore, the zirconoxane is preferably a zirconoxane represented byFormula a2-2 below from the viewpoint of film physical properties.

Ti_(α)O_(β)(OR)_(γ)  (a2-1)

Zr_(α)O_(β)(OR)_(γ)  (a2-2)

In Formula a2-1 and Formula a2-2, the Rs independently denote a hydrogenatom, an alkyl group having 1 to 18 carbons, an aryl group having 6 to18 carbons, or an aralkyl group having 7 to 18 carbons, α, β, and γsatisfy conditions a′ to c′ below, α denotes a positive integer, and βand γ denote a positive number.

200≧α≧2,   a′:

1.9α≧β≧1.0α,   b′:

γ=4α−2β  c′:

The titanoxane, zirconoxane, and titanoxane-zirconoxane condensationproduct denoted by a2 may be one having a single formula or a mixture oftwo or more types.

a3: Titanium Atom- and/or Zirconium Atom-Containing Metal Oxide

The titanium atom- and/or zirconium atom-containing composite oxide ispreferably titanium oxide, a titanium composite oxide, zirconium oxide,or a zirconium composite oxide, more preferably titanium oxide, atitanium composite oxide, or zirconium oxide, yet more preferablytitanium oxide or zirconium oxide, and particularly preferably titaniumoxide.

The titanium oxide is particularly preferably a rutile type, which has ahigh refractive index.

Furthermore, a3 preferably comprises metal oxide particles.

As a3, commercial products may be used, and examples include, astitanium oxide particles, the TTO series (TTO-51 (A), TTO-51 (C), etc.),TTO-S, and the V series (TTO-S-1, TTO-S-2, TTO-V-3, etc.) manufacturedby Ishihara Sangyo Kaisha Ltd., the MT series manufactured by TaycaCorporation (MT-01, MT-05, etc.), as tin oxide-titanium oxide compositeparticles Optolake TR-502 and Optolake TR-504 (both from JGC C & C), assilicon oxide-titanium oxide composite particles Optolake TR-503,Optolake TR-513, Optolake TR-520, Optolake TR-521, and Optolake TR-527(all from JGC C & C), zirconium oxide particles (Kojundo ChemicalLaboratory Co., Ltd.), and tin oxide-zirconium oxide composite particles(JGC C & C).

Furthermore, a3 preferably comprises metal oxide particles.

From the viewpoint of transparency, the average primary particle size ofa3 is preferably 1 to 200 nm, more preferably 3 to 80 nm, andparticularly preferably 5 to 50 nm. The average primary particle size ofparticles referred to here means the arithmetic average of the particlesize of any 200 particles measured using an electron microscope. Whenthe shape of the particles is not spherical, the size corresponds to thelongest side.

Moreover, a3 may be supplied for use as a dispersion prepared by mixingand dispersing in an appropriate dispersant and solvent using a mixersuch as a ball mill or a rod mill.

The refractive index-adjusting agent is preferably a fluorene compound.

Furthermore, a fluorene ring structure may be introduced into theorganic resin by copolymerization of a monomer having a fluorene ringwith a resin such as a polymer.

The organic resin preferably has a fluorene ring structure as describedbelow. Due to it having a fluorene ring structure, the transparencybecomes higher.

The fluorene ring structure may have a substituent on the aromatic ring,and the substituents may be bonded to each other to form an alicyclic oraromatic ring.

Preferred examples of the substituent include a halogen atom, an alkylgroup, an aryl group, an alkoxy group, an aryloxy group, an alkylthiogroup, and an arylthio group, more preferred examples include a halogenatom, an alkyl group, and an alkoxy group, and yet more preferredexamples include an alkyl group.

The monomer having a fluorene ring preferably comprises a reactivegroup-containing fluorene compound below.

Preferred examples of the reactive group-containing fluorene compoundinclude compounds represented by Formula I below.

In Formula I, Ar^(1f) and Ar^(2f) independently denote an arylene group,R^(1f) and R^(2f) independently denote a hydroxy group, a carboxy group,an alkoxy group, or a monovalent organic group containing at least onetype of group selected from the group consisting of a hydroxy group, acarboxy group, an epoxy group, and an oxetanyl group, at least one ofR^(1f) and R^(2f) is a hydroxy group, a carboxy group, or a monovalentorganic group containing at least one type of group selected from thegroup consisting of a hydroxy group, a carboxy group, an epoxy group,and an oxetanyl group, R^(3f) and R^(4f) independently denote amonovalent substituent, p and q independently denote an integer of 0 to4, and different R^(3f)s and different R^(4f)s may be bonded to eachother to form an alicyclic or aromatic ring.

Specific examples of the fluorene compound include a compound describedin paragraph 0018 of Japanese registered patent No. 5186200, a compounddescribed in paragraph 0011 of JP-A-4-325508, and a compound describedin paragraphs 0025 to 0049 of International Laid-open Patent No.2014/199967.

With regard to the fluorene compound, one type may be used on its own ortwo or more types may be used in combination.

The content of the fluorene compound in the 1st layer to the N-1th layeris preferably 0.1 to 40 mass %, more preferably 0.5 to 30 mass %, andyet more preferably 1 to 20 mass %. When in this range, the transparencyand strength are excellent.

Each of the different refractive index layers in the protective layermay comprise another additive in addition to the above components.Examples of the other additive include those known as an additive for aresist or a photosensitive composition.

<Transparent Electrode>

The transparent electrode in the touch panel member of the presentinvention is an electrode for detecting touch and is formed above atransparent substrate.

The transmittance for light having a wavelength of 400 nm of thetransparent electrode is preferably 80% or greater, more preferably 85%or greater, and particularly preferably 90% or greater.

From the viewpoint of resistance and transmittance, the film thicknessof the transparent electrode is preferably 5 to 500 nm, more preferably10 to 400 nm, and particularly preferably 30 to 300 nm.

From the viewpoint of prevention of total reflection, prevention offramework visibility, and prevention of taper visibility, the refractiveindex of the transparent electrode is preferably no greater than 2.40,more preferably no greater than 2.30, yet more preferably no greaterthan 2.20, and particularly preferably no greater than 2.10.

Furthermore, from the viewpoint of production stability and driveefficiency, the refractive index of the transparent electrode ispreferably 1.76 or greater, more preferably 1.86 or greater, and yetmore preferably 1.90 or greater.

From the viewpoint of drive efficiency, the surface resistivity of thetransparent electrode is preferably 0.1 to 1,000 Q/square, and morepreferably 1 to 200 Q/square.

From the viewpoint of production stability, the taper angle of a sideface of the transparent electrode is preferably 2° to 80°, morepreferably 5° to 70°, and particularly preferably 10° to 65°.

The taper angle of a side face of the transparent electrode in thepresent invention is defined as the angle formed between the side faceof the transparent electrode and the face of the transparent substrateon which the transparent electrode is provided. For example, a taperangle of 90° means that the side face of the transparent electrode isperpendicular to the face of the transparent substrate on which thetransparent electrode is provided.

The material of the transparent electrode is not particularly limited aslong as the performance as a transparent electrode can be satisfied, anda known material may be used.

The transparent electrode is a layer that has transmittance in thevisible light region and has conductivity.

As a method for forming the transparent electrode, any conventionallyknown technique such as a vacuum vapor deposition method, a sputteringmethod, or an ion plating method may be used, but from the viewpoint offilm uniformity and adhesion of a thin film to a transparent substrate,formation of a thin film by a sputtering method is preferable. It isalso possible to form a transparent electrode having a desired shapefrom a thin film by a known method such as masking or etching.

A thin film material used is not particularly limited, and preferredexamples include a metal oxide such as a tin oxide-containing indiumoxide or an antimony-containing tin oxide as well as gold, silver,platinum, palladium, copper, aluminum, nickel, chromium, titanium,cobalt, tin, zinc, and an alloy thereof.

Specific examples include zinc oxide (ZnO), GZO (Ga-doped ZnO), AZO(Al-doped ZnO), silver, ITO (indium tin oxide), and IZO (indium zincoxide). Among them, ITO or IZO is preferable.

<Transparent Substrate>

The transparent substrate for the touch panel member of the presentinvention is not particularly limited as long as a substrate istransparent.

Examples of the substrate include an inorganic substrate, a resinsubstrate, and a resin composite material substrate.

Examples of the inorganic substrate include glass, quartz, silicon,silicon nitride, and a composite substrate formed by vapor deposition ofmolybdenum, titanium, aluminum, copper, etc. on such a substrate.

Examples of the resin substrate include a substrate consisting ofsynthetic resins such as polybutylene terephthalate, polyethyleneterephthalate, polyethylene naphthalate, polybutylene naphthalate,polystyrene, polycarbonate, polysulfone, polyether sulfone,polyallylate, an allyldiglycolcarbonate resin, polyamide, polyimide,polyamide-imide, polyetherimide, polybenzazole, polyphenylene sulfide, apolycycloolefin, a norbornene resin, a fluorine resin such aspolychlorotrifluoroethylene, a liquid crystal polymer, an acrylic resin,an epoxy resin, a silicone resin, an ionomer resin, a cyanate resin, acrosslinked fumaric acid diester, a cyclic polyolefin, an aromatic etherresin, a maleimide-olefin copolymer, cellulose, and an episulfide resin.

These transparent substrates are not often used in their ‘as is’configuration, and are usually formed into a multilayer structure suchas for example in a thin film transistor (TFT) device according to theconfiguration of the final product.

Among them, a polyester film or a glass substrate is preferable, and apolyethylene terephthalate (PET) film or a glass substrate is morepreferable.

The thickness of the transparent substrate is not particularly limitedbut is preferably 0.5 μm to 2 mm.

<Adjacent Layer>

The touch panel member of the present invention may comprise an adjacentlayer that is adjacent to the protective layer (the Nth layer) on theside opposite to the transparent substrate.

The adjacent layer is not particularly limited, and preferred examplesinclude a pressure-sensitive adhesion layer.

Furthermore, the touch panel member of the present invention may nothave an adjacent layer, and in this case the Nth layer is in contactwith air.

Preferred examples of the pressure-sensitive adhesion layer include atacky layer for laminating a protective layer-equipped transparentelectrode substrate (the touch panel member of the present inventionthat has no adjacent layer) on a polarizing plate, a cover substrate, adisplay device, etc.

From the viewpoint of a decrease in total reflection, the refractiveindex of the pressure-sensitive adhesion layer is preferably 1.35 to1.65, and more preferably 1.40 to 1.60.

The touch panel member of the present invention may comprise a knownlayer other than the transparent substrate, the transparent electrode,the protective layer, and the adjacent layer. Examples include aprotective layer, an insulating layer, an adhesion layer, and apressure-sensitive adhesion layer that is other than the above adjacentlayer.

The touch panel member of the present invention is further explained byreference to the drawing.

FIG. 1 is a conceptual sectional view showing one example of the touchpanel member of the present invention.

A touch panel member 10 shown in FIG. 1 comprises a plurality oftransparent electrodes 14 having a trapezoidal cross-sectional shapeabove a transparent substrate 12, and a protective layer 16 is providedso as to cover the transparent electrodes 14.

The protective layer 16 comprises three layers, that is, a 1st layer 16a, a 2nd layer 16 b, and a 2nd layer 16 c.

The refractive index of the 1st layer 16 a is higher than the refractiveindex of the 2nd layer 16 b, and the difference in refractive indexbetween the 1st layer 16 a and the 2nd layer 16 b is greater than 0 butno greater than 0.20. The refractive index of the 2nd layer 16 b ishigher than the refractive index of the 3rd layer 16 c, and thedifference in refractive index between the 2nd layer 16 b and the 3rdlayer 16 c is greater than 0 but no greater than 0.20.

The absolute value of the difference in refractive index between thetransparent electrode 14 and the 1st layer 16 a is no greater than 0.20.

Furthermore the difference in refractive index between the 1st layer 16a and the 3rd layer 16 c is 0.20 or greater.

Moreover, there may be another adjacent layer (not illustrated) abovethe 3rd layer 16 c.

{Composition for Formation of Protective Layer}

Each of the protective layers of the touch panel member of the presentinvention is preferably formed using a composition for formation of aprotective layer.

The composition for formation of a protective layer is preferably acurable composition.

The composition for formation of a protective layer is preferably aphotosensitive composition, and more preferably a positive-workingphotosensitive composition or a negative-working photosensitivecomposition.

Component A: at least One Type Selected from the Group Consisting of a1to a3

The composition for formation of a protective layer comprises asComponent A at least one type selected from the group consisting of a1to a3 below.

a1: an alkoxy group-containing titanium compound and/or zirconiumcompound,

a2: a titanoxane, zirconoxane and/or titanoxane-zirconoxane condensationproduct having at least one alkoxy group directly connected to atitanium atom or a zirconium atom,

a3: a titanium atom- and/or zirconium atom-containing metal oxide.

Preferred embodiments of Component A are the same as those of ComponentA described above.

The content of Component A is preferably 15 to 80 mass % relative to thetotal solids content of the photosensitive composition, more preferably20 to 70 mass %, and yet more preferably 40 to 65 mass %. The ‘solidscontent’ in the photosensitive composition denotes components excludingvolatile components such as solvent. Needless to say the solids contentmay be not only for a solid but also for a liquid.

Component B: Polymer

The composition for formation of a protective layer preferably comprisesa polymer.

The resin is not particularly limited, and a known resin used as aresist may preferably be used.

With regard to the polymer, one type thereof may be used on its own ortwo or more types may be contained.

When the composition for formation of a protective layer is apositive-working photosensitive composition, the polymer preferablycomprises a polymer having a constituent unit containing a group formedfrom an acid group protected by an acid-decomposable group.

In the present invention, the ‘constituent unit containing a groupformed from an acid group protected by an acid-decomposable group’ isalso called ‘constituent unit b1’.

Furthermore, when the composition for formation of a protective layer isa negative-working photosensitive composition, the polymer preferablycomprises an alkali-soluble resin.

—Polymer having Constituent Unit Containing Group that is Formed fromAcid Group Protected by Acid-Decomposable Group—

The composition for formation of a protective layer preferably comprisesa polymer having a constituent unit containing a group formed from anacid group protected by an acid-decomposable group (hereinafter, alsocalled ‘Component B-1’).

The composition for formation of a protective layer may comprise apolymer other than the polymer having a constituent unit containing agroup formed from an acid group protected by an acid-decomposable group.

Component B-1 is preferably an addition-polymerization type resin, andmore preferably a polymer containing a constituent unit derived from(meth)acrylic acid and/or an ester thereof (acrylic resin). It may havea constituent unit other than a constituent unit derived from(meth)acrylic acid and/or an ester thereof, for example, astyrene-derived constituent unit or a vinyl compound-derived constituentunit.

Component B-1 is a polymer having at least constituent unit b1containing a group formed from an acid group protected by anacid-decomposable group. Due to Component B-1 comprising a polymerhaving constituent unit b1, a very high sensitivity photosensitivecomposition can be obtained.

With regard to the ‘group formed from an acid group protected by anacid-decomposable group’ in the present invention, a known acid groupand acid-decomposable group may be used and are not particularlylimited. Specific preferred examples of the acid group include acarboxyl group and a phenolic hydroxy group. As the acid-decomposablegroup, a group that is relatively easily decomposed by an acid (forexample, an acetal-based functional group such as an acetal structure, aketal structure, a tetrahydropyranyl ester group, or a tetrahydrofuranylester group) or a group that is relatively difficultly decomposed by anacid (for example, a tertiary alkyl group such as a tert-butyl estergroup or a tertiary alkyl carbonate group such as a tert-butyl carbonategroup) may be used.

The constituent unit b1 containing a group formed from an acid groupprotected by an acid-decomposable group is preferably a constituent unitcontaining a protected carboxyl group formed from a carboxyl groupprotected by an acid-decomposable group (also called a ‘constituent unitcontaining a protected carboxyl group protected by an acid-decomposablegroup’) or a constituent unit containing a protected phenolic hydroxygroup formed from a phenolic hydroxy group protected by anacid-decomposable group (also called a ‘constituent unit containing aprotected phenolic hydroxy group protected by an acid-decomposablegroup’).

Preferred examples of the acid-decomposable group include a1-ethoxyethyl group, a 1-butoxyethyl group, a 1-benzyloxyethyl group, a1-cyclohexyloxyethyl group, a tetrahydrofuranyl group, and atetrahydropyranyl group

It is preferable for Component B-1 to comprise a crosslinkable group,and it is more preferable for it to comprise a constituent unitcontaining a crosslinkable group.

The crosslinkable group is not particularly limited as long as it is agroup that undergoes a curing reaction by a thermal treatment.

The crosslinkable group is preferably an epoxy group, an oxetanyl group,a group represented by —NH—CH₂—O—R (R denotes a hydrogen atom or analkyl group having 1 to 20 carbons), or an ethylenically unsaturatedgroup, and is more preferably an epoxy group or an oxetanyl group.

Specific examples of a monomer used in order to form a constituent unitcontaining an epoxy group include glycidyl acrylate, glycidylmethacrylate, glycidyl α-ethylacrylate, glycidyl α-n-propylacrylate,glycidyl α-n-butylacrylate, 3,4-epoxybutyl acrylate, 3,4-epoxybutylmethacrylate, 3,4-epoxycyclohexylmethyl acrylate,3,4-epoxycyclohexylmethyl methacrylate, 3,4-epoxycyclohexylmethylα-ethylacrylate, o-vinylbenzyl glycidyl ether, m-vinylbenzyl glycidylether, p-vinylbenzyl glycidyl ether, and alicyclic epoxyskeleton-containing compounds described in paragraphs 0031 to 0035 ofJapanese registered patent No. 4168443.

Specific examples of a monomer used in order to form a constituent unitcontaining an oxetanyl group include oxetanyl group-containing(meth)acrylic acid esters described in paragraphs 0011 to 0016 ofJP-A-2001-330953.

It is preferable for Component B-1 to comprise an acid group, and it ismore preferable for it to comprise a constituent unit containing an acidgroup.

Examples of the acid group include a carboxylic acid group, asulfonamide group, a phosphonic acid group, a sulfonic acid group, aphenolic hydroxy group, a sulfonamide group, a sulfonylimide group, anacid anhydride group of the above acid groups, and a group that isformed by neutralizing the above acid groups to form a salt structure; acarboxylic acid group and/or a phenolic hydroxy group are preferable.Preferred examples of the salt include, but are not particularly limitedto, an alkali metal salt, an alkaline earth metal salt, and an organicammonium salt.

The constituent unit containing an acid group is more preferably aconstituent unit derived from a styrene compound, a constituent unitderived from a vinyl compound, or a constituent unit derived from(meth)acrylic acid and/or an ester thereof.

In the present invention, it is particularly preferable from theviewpoint of sensitivity for it to comprise a constituent unitcontaining a carboxyl group or a constituent unit containing a phenolichydroxy group.

Specific examples of monomers used in the polymerization of ComponentB-1 include constituent units from styrene, tert-butoxystyrene,methylstyrene, α-methylstyrene, acetoxystyrene, methoxystyrene,ethoxystyrene, chlorostyrene, methyl vinylbenzoate, ethyl vinylbenzoate,methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate,isopropyl (meth)acrylate, benzyl (meth)acrylate, isobornyl(meth)acrylate, acrylonitrile, and ethylene glycol monoacetoacetatemono(meth)acrylate. Examples other than the above include compoundsdescribed in paragraphs 0021 to 0024 of JP-A-2004-264623.

From the viewpoint of electrical characteristics, Component B-1preferably comprises a constituent unit derived from a styrene or amonomer having an aliphatic ring skeleton, and more preferably comprisesa constituent unit derived from a monomer having an aliphatic ringskeleton. Specific examples of these monomers include styrene,tert-butoxystyrene, methylstyrene, α-methylstyrene, dicyclopentanyl(meth)acrylate, cyclohexyl (meth)acrylate, isobornyl (meth)acrylate,benzyl (meth)acrylate, and dicyclopentanyl (meth)acrylate.

Furthermore, from the viewpoint of adhesion, Component B-1 is preferablya constituent unit derived from an alkyl (meth)acrylate ester. Specificexamples of the alkyl (meth)acrylate ester include methyl(meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, and n-butyl(meth)acrylate; methyl (meth)acrylate is more preferable.

Constituent unit b1 is preferably 50 to 100 mole % relative to the totalconstituent units of Component B-1, more preferably 10 to 90 mole %, yetmore preferably 10 to 60 mole %, and particularly preferably 20 to 50mole %.

The constituent unit containing a crosslinkable group is preferably 5 to90 mole % relative to the total constituent units of Component B-1, morepreferably 10 to 80 mole %, and yet more preferably 10 to 60 mole %.

The constituent unit containing an acid group is preferably 1 to 80 mole% relative to the total constituent units of Component B-1, morepreferably 1 to 50 mole %, yet more preferably 5 to 40 mole %,particularly preferably 5 to 30 mole %, and most preferably 5 to 20 mole%.

Constituent units other than the above are preferably no greater than 60mole % relative to the total constituent units of Component B-1, morepreferably no greater than 50 mole %, and yet more preferably no greaterthan 40 mole %. The lower limit value may be 0 mole %, but it ispreferably for example at least 1 mole %, and more preferably at least 5mole %.

In the present invention, when the content of a ‘constituent unit’ isdefined on the basis of molar ratio, the ‘constituent unit’ has the samemeaning as that of ‘monomer unit’. The ‘monomer unit’ in the presentinvention may be modified after polymerization using a polymer reaction,etc.

The molecular weight of Component B-1 is preferably 1,000 to 200,000 asa weight-average molecular weight on a polystyrene basis, and morepreferably 2,000 to 50,000. When within this numerical range, variousproperties are good. The ratio of number-average molecular weight Mn andweight-average molecular weight Mw (dispersity, Mw/Mn) is preferably 1.0to 5.0, and more preferably 1.5 to 3.5.

Furthermore, as Component B-1, resins described in paragraphs 0016 to0080 of JP-A-2014-132292 may suitably be used.

The content of Component B-1 in the positive-working photosensitivecomposition is preferably 20 to 99.9 mass % relative to the total solidscontent of the photosensitive composition, more preferably 50 to 98 mass%, and yet more preferably 70 to 95 mass %. When the content is in thisrange, pattern forming properties when developed are good, and a curedmaterial having a higher refractive index is obtained.

Alkali-Soluble Resin—

From the viewpoint of resolution and film properties improvement, thecomposition for formation of a protective layer preferably comprises analkali-soluble resin (hereinafter, also called ‘Component B-2’).

Component B-2 is not particularly limited, and a known alkali-solubleresin may be used.

A polar group that imparts alkali solubility to the alkali-soluble resinis not particularly limited, and it may comprise a known polar group;preferred examples include a carboxyl group, a hydroxy group, aphosphoric acid group, and a sulfonic acid group, and a carboxyl groupis particularly preferable.

The binder polymer is preferably a linear organic polymer. As such alinear organic polymer, any known polymer may be used, but an acrylicresin is preferable. The linear organic polymer may not only be used asa film-forming agent but may also be selected according to the intendedapplication with a developing compound in using an aqueous, weaklyalkaline aqueous, or organic solvent type developer. For example, when awater-soluble organic polymer is used, development with water becomespossible. Examples of such a linear organic polymer include a radicalpolymer containing a carboxylic acid group in a side chain such as thosedescribed in JP-A-59-44615, JP-B-54-34327 (JP-B denotes a Japaneseexamined patent application publication), JP-B-58-12577, JP-B-54-25957,JP-A-54-92723, JP-A-59-53836, and JP-A-59-71048, that is, a resin formedby homopolymerization or copolymerization of a carboxyl group-containingmonomer, a resin formed by hydrolysis, half-esterification, orhalf-amidation of an acid anhydride unit of a homopolymer or copolymerof an acid anhydride-containing monomer, and an epoxyacrylate formed bymodifying an epoxy resin with an unsaturated monocarboxylic acid or acidanhydride.

Examples of the carboxyl group-containing monomer include acrylic acid,methacrylic acid, itaconic acid, crotonic acid, maleic acid, fumaricacid, and 4-carboxylstyrene.

Examples of the acid anhydride-containing monomer include maleicanhydride.

Similarly, examples include an acidic cellulose derivative containing acarboxylic acid group in a side chain. Other than the above, one formedby adding a cyclic acid anhydride to a hydroxy group-containing polymeris also useful.

The weight-average molecular weight of the alkali-soluble resin ispreferably at least 5,000, and more preferably at least 10,000 but nogreater than 300,000, and the number-average molecular weight ispreferably at least 1,000, and more preferably at least 2,000 but nogreater than 250,000. The polydispersity (weight-average molecularweight/number-average molecular weight) is preferably at least 1, andmore preferably at least 1.1 but no greater than 10.

The resin that can be used in the present invention may be any of arandom polymer, a block polymer, a graft polymer, etc.

The content of Component B-2 in the negative-working photosensitivecomposition is preferably 1 to 40 mass % relative to the total solidscontent of the negative-working photosensitive composition, morepreferably 3 to 30 mass %, and yet more preferably 4 to 20 mass %.

Component C: Fluorene Compound

The composition for formation of a protective layer preferably comprisesa fluorene compound, and more preferably comprises a reactivegroup-containing fluorene compound. Due to a fluorene compound beingused, it is possible to easily introduce a fluorene ring structure intothe polymer.

Furthermore, a fluorene ring structure may be introduced into theorganic resin by copolymerization of a monomer having a fluorene ringwith a polymer such as a binder polymer.

Preferred embodiments of Component C are the same as those of thefluorene compound described above.

With regard to the fluorene compound, one type may be used on its own ortwo or more types may be used in combination.

The content of the fluorene compound in the composition for formation ofa protective layer is preferably 1 to 200 parts by mass relative to 100parts by mass of the total content of a Component B, more preferably 5to 150 parts by mass, yet more preferably 10 to 150 parts by mass, andparticularly preferably 50 to 120 parts by mass. With this embodiment, acured material that is obtained has a higher refractive index, a lowerdielectric constant, and better transparency.

Component D: Photo-Acid Generator

The composition for formation of a protective layer preferably comprisesa photo-acid generator as Component D; in particular when thecomposition for formation of a protective layer is a positive-workingphotosensitive composition, it particularly preferably comprises aphoto-acid generator.

The ‘light’ is not particularly limited as long as it is actinicradiation that can apply energy that can generate an initiating speciesfrom the photo-acid generator and/or a photopolymerization initiator,which is described later, upon irradiation therewith, and widelyincludes α-rays, γ-rays, X rays, ultraviolet (UV), visible light, and anelectron beam. Among them, light containing at least UV is preferable.

Furthermore, when the composition for formation of a protective layer isa positive-working photosensitive composition, it is preferably achemically amplified type positive-working photosensitive composition(chemically amplified positive-working photosensitive composition) andmay be a non-chemically amplified type positive-working photosensitivecomposition that employs a 1,2-quinone diazide compound as a photo-acidgenerator sensitive to actinic radiation. In terms of high sensitivityand excellent transparency, it is preferably a chemically amplifiedpositive-working photosensitive composition.

The photo-acid generator used in the present invention is preferably acompound that is sensitive to actinic radiation having a wavelength ofat least 300 nm, and preferably a wavelength of 300 to 450 nm, and thatgenerates an acid, but its chemical structure is not limited.Furthermore, with regard to a photo-acid generator that is not directlysensitive to actinic radiation having a wavelength of at least 300 nm, acompound that becomes sensitive to actinic radiation having a wavelengthof at least 300 nm when used in combination with a sensitizer and thatgenerates an acid may be used preferably in combination with asensitizer. As the photo-acid generator used in the present invention, aphoto-acid generator that has a pKa of no greater than 4 and that cangenerate an acid is preferable, a photo-acid generator that has a pKa ofno greater than 3 and that can generate an acid is more preferable, anda photo-acid generator that has a pKa of no greater than 2 and that cangenerate an acid is most preferable.

Examples of the photo-acid generator include atrichloromethyl-s-triazine, a sulfonium salt, an iodonium salt, aquaternary ammonium salt, a diazomethane compound, an imidosulfonatecompound, and an oxime sulfonate compound. Among them, from theviewpoint of insulating properties and sensitivity, it is preferable touse an oxime sulfonate compound. With regard to these photo-acidgenerators, one type may be used on its own or two or more types may beused in combination. Specific examples of a trichloromethyl-s-triazine,a diaryliodonium salt, a triarylsulfonium salt, a quaternary ammoniumsalt, and a diazomethane derivative include compounds described inparagraphs 0083 to 0088 of JP-A-2011-221494.

Preferred examples of an oxime sulfonate compound, that is, a compoundhaving an oxime sulfonate structure, include a compound containing anoxime sulfonate structure represented by Formula D1 below.

In Formula D1, R²¹ denotes an alkyl group or an aryl group, and the wavyline portion denotes the position via which it is bonded to anothergroup.

All groups may be substituted, and the alkyl group denoted by R²¹ may bestraight-chain, branched, or cyclic. Allowed substituents are explainedbelow.

The alkyl group of R²¹ is preferably a straight-chain or branched alkylgroup having 1 to 10 carbons. The alkyl group of R²¹ may be substitutedwith an aryl group having 6 to 11 carbons, an alkoxy group having 1 to10 carbons, or a cycloalkyl group (preferably a bicycloalkyl group, etc.including a bridged alicyclic group such as a7,7-dimethyl-2-oxonorbornyl group).

The aryl group denoted by R²¹ is preferably an aryl group having 6 to 11carbons, and more preferably a phenyl group or a naphthyl group. Thearyl group of R²¹ may be substituted with an alkyl group having 1 to 10carbons, an alkoxy group having 1 to 10 carbons, or a halogen atom.

Examples of the oxime sulfonate compound include compounds described inparagraphs 0114 to 0120 of JP-A-2011-221494 and paragraphs 0116 to 0145of JP-A-2014-132292, but the present invention is not limited thereto.

In the composition for formation of a protective layer, the photo-acidgenerator is preferably used at 0.1 to 30 parts by mass relative to 100parts by mass of the resin in the composition for formation of aprotective layer, more preferably 0.1 to 10 parts by mass, andparticularly preferably 0.5 to 10 parts by mass.

Furthermore, with regard to the photo-acid generator, one type may beused on its own or two or more types may be used in combination.

Component E: Ethylenically Unsaturated Compound

The composition for formation of a protective layer preferably comprisesan ethylenically unsaturated compound as Component E; when thecomposition for formation of a protective layer is a negative-workingphotosensitive composition in particular, it is more preferable for itto comprise an ethylenically unsaturated compound, and it is yet morepreferable for it to comprise a tri- or higher-functional ethylenicallyunsaturated compound.

The ethylenically unsaturated compound in the present invention is anaddition-polymerizable compound having at least one ethylenicallyunsaturated double bond, and is preferably selected from compoundshaving at least one, and preferably two, terminal ethylenicallyunsaturated bonds. Such compounds are widely known in the presenttechnical field, and in the present invention they can be used withoutparticular limitations.

They have a chemical configuration such as for example a monomer, aprepolymer, that is, a dimer, a trimer, or an oligomer, or a mixturethereof, or a copolymer thereof. Examples of the monomer and thecopolymer thereof include an unsaturated carboxylic acid (for example,acrylic acid, methacrylic acid, itaconic acid, crotonic acid,isocrotonic acid, maleic acid, etc.), an ester thereof, and an amidethereof, and it is preferable to use an ester of an unsaturatedcarboxylic acid with an aliphatic polyhydric alcohol compound or anamide of an unsaturated carboxylic acid with an aliphatic polyaminecompound. Furthermore, an addition reaction product of an unsaturatedcarboxylic acid ester or unsaturated carboxylamide having a nucleophilicsubstituent such as a hydroxy group, an amino group, or a mercapto groupwith a monofunctional or polyfunctional isocyanate or epoxy, or adehydration-condensation reaction product with a monofunctional orpolyfunctional carboxylic acid is also suitably used. Furthermore, anaddition reaction product of an unsaturated carboxylic acid ester orunsaturated carboxylamide having an electrophilic substituent such as anisocyanate group or an epoxy group with a monofunctional orpolyfunctional alcohol, amine, or thiol; and a substitution reactionproduct of an unsaturated carboxylic acid ester or unsaturatedcarboxylamide having a leaving substituent such as a halogen group or atosyloxy group with a monofunctional or polyfunctional alcohol, amine,or thiol are also suitable. Moreover, as another example, instead of theabove unsaturated carboxylic acid, a group of compounds in which it isreplaced by an unsaturated phosphonic acid, a styrene, a vinyl ether,etc. may also be used.

Specific examples of the ester monomer of an aliphatic polyhydricalcohol compound with an unsaturated carboxylic acid include an acrylicacid ester such as ethylene glycol diacrylate, triethylene glycoldiacrylate, 1,3-butanediol diacrylate, tetramethylene glycol diacrylate,propylene glycol diacrylate, neopentyl glycol diacrylate,trimethylolpropane triacrylate, trimethylolpropanetris(acryloyloxypropyl) ether, trimethylolethane triacrylate, hexanedioldiacrylate, 1,4-cyclohexanediol diacrylate, tetraethylene glycoldiacrylate, pentaerythritol diacrylate, pentaerythritol triacrylate,pentaerythritol tetraacrylate, dipentaerythritol diacrylate,dipentaerythritol hexaacrylate, sorbitol triacrylate, sorbitoltetraacrylate, sorbitol pentaacrylate, sorbitol hexaacrylate,tris(acryloyloxyethyl) isocyanurate, a polyester acrylate oligomer, oran isocyanuric acid ethylene oxide (EO)-modified triacrylate.

Examples of methacrylic acid esters include tetramethylene glycoldimethacrylate, triethylene glycol dimethacrylate, neopentyl glycoldimethacrylate, trimethylolpropane trimethacrylate, trimethylolethanetrimethacrylate, ethylene glycol dimethacrylate, 1,3-butanedioldimethacrylate, hexanediol dimethacrylate, pentaerythritoldimethacrylate, pentaerythritol trimethacrylate, pentaerythritoltetramethacrylate, dipentaerythritol dimethacrylate, dipentaerythritolhexamethacrylate, sorbitol trimethacrylate, sorbitol tetramethacrylate,bis[p-(3-methacryloxy-2-hydroxypropoxy)phenyl]dimethylmethane, andbis[p-(methacryloxyethoxy)phenyl]dimethylmethane.

Examples of itaconic acid esters include ethylene glycol diitaconate,propylene glycol diitaconate, 1,3-butanediol diitaconate, 1,4-butanedioldiitaconate, tetramethylene glycol diitaconate, pentaerythritoldiitaconate, and sorbitol tetraitaconate.

Examples of crotonic acid esters include ethylene glycol dicrotonate,tetramethylene glycol dicrotonate, pentaerythritol dicrotonate, andsorbitol tetradicrotonate.

Examples of isocrotonic acid esters include ethylene glycoldiisocrotonate, pentaerythritol diisocrotonate, and sorbitoltetraisocrotonate.

Examples of maleic acid esters include ethylene glycol dimalate,triethylene glycol dimalate, pentaerythritol dimalate, and sorbitoltetramalate.

Examples of other esters that can suitably be used include aliphaticalcohol esters described in JP-B-51-47334 and JP-A-57-196231, thosehaving an aromatic skeleton described in JP-A-59-5240, JP-A-59-5241, andJP-A-2-226149, and those having an amino group described inJP-A-1-165613. Furthermore, the above ester monomers may also be used asmixtures.

Furthermore, specific examples of the amide monomer of an aliphaticpolyamine compound with an unsaturated carboxylic acid include methylenebisacrylamide, methylene bismethacrylamide, 1,6-hexamethylenebisacrylamide, 1,6-hexamethylene bismethacrylamide, diethylenetriaminetrisacrylamide, xylylene bisacrylamide, and xylylene bismethacrylamide.

Preferred examples of other amide monomers include those having acyclohexylene structure described in JP-B-54-21726.

Moreover, urethane acrylates described in JP-A-51-37193, JP-B-2-32293,and JP-B-2-16765 and urethane compounds having an ethylene oxideskeleton described in JP-B-58-49860, JP-B-56-17654, JP-B-62-39417, andJP-B-62-39418 are also suitable. Furthermore, due to the use of apolymerizable compound having an amino structure or a sulfide structurein the molecule described in JP-A-63-277653, JP-A-63-260909, andJP-A-1-105238, a photosensitive composition having very good developmentspeed can be obtained.

Other examples include polyfunctional acrylates and methacrylates suchas epoxyacrylates obtained by a reaction between (meth)acrylic acid andan epoxy resin and polyester acrylates described in each ofJP-A-48-64183, JP-B-49-43191, and JP-B-52-30490. Furthermore, examplesalso include specific unsaturated compounds described in JP-B-46-43946,JP-B-1-40337, and JP-B-1-40336 and vinyl phosphonic acid-based compoundsdescribed in JP-A-2-25493. In some cases, a structure containing aperfluoroalkyl group described in JP-A-61-22048 is suitably used.Furthermore, photocurable monomers and oligomers described in theJournal of the Adhesion Society of Japan Vol. 20, No. 7, pp. 300 to 308(1984) may also be used.

With regard to these ethylenically unsaturated compounds, the structurethereof and details of the method in terms of their use alone or incombination, the amount added, etc. may be set freely according to thefinal performance design of the photosensitive composition. For example,they are selected from the following viewpoints.

In terms of sensitivity, the larger the content of unsaturated groupsper molecule in the structure, the more preferable it is, and in manycases a di- or higher-functional structure is preferable. In order toenhance the strength of a cured film, a tri- or higher-functionalstructure is preferable, and a method in which both sensitivity andstrength are adjusted by the combined use of ones having differentfunctionality and/or different polymerizable groups (for example, anacrylic acid ester, a methacrylic acid ester, a styrene compound, or avinyl ether compound) is also effective.

Furthermore, selection of the ethylenically unsaturated compound and themethod of use are important factors for compatibility and dispersibilitywith respect to other components (for example, a photopolymerizationinitiator, inorganic particles, etc.) and, for example, compatibilitycan be improved by the use of a low purity compound or by the combineduse of two or more types of other components. Moreover, for the purposeof improving adhesion to a hard surface such as a substrate, a specificstructure can be selected.

The content of the ethylenically unsaturated compound is preferably 5 to90 mass % relative to the total solids content of the composition forformation of a protective layer, more preferably 10 to 85 mass %, andyet more preferably 20 to 80 mass %. When in this range, adhesion anddevelopability are both good without the refractive index beingdegraded.

Component F: Photopolymerization Initiator

The composition for formation of a protective layer preferably comprisesas Component F a photopolymerization initiator, and when the compositionfor formation of a protective layer is a negative-working photosensitivecomposition in particular, it particularly preferably comprises aphotopolymerization initiator.

The photopolymerization initiator also includes Component D, but thephotopolymerization initiator is preferably a radicalphotopolymerization initiator.

The photopolymerization initiator used in the present invention ispreferably a compound that is decomposed by light and initiates andpromotes polymerization of a polymerizable compound such as anethylenically unsaturated compound and that has absorption in awavelength region of at least 300 nm but no greater than 500 nm. Withregard to the photopolymerization initiator, one type may be used on itsown or two more types may be used in combination.

Examples of the photopolymerization initiator include an oxime estercompound, an organic halide compound, an oxydiazole compound, a carbonylcompound, a ketal compound, a benzoin compound, an acridine compound, anorganic peroxide compound, an azo compound, a coumarin compound, anazide compound, a metallocene compound, a hexaarylbiimidazole compound,an organoboric acid compound, a disulfonic acid compound, an onium saltcompound, and an acylphosphine (oxide) compound. Among them, from theviewpoint of sensitivity, an oxime ester compound and ahexaarylbiimidazole compound are preferable, and an oxime ester compoundis more preferable.

As the oxime ester compound, compounds described in JP-A-2000-80068,JP-A-2001-233842, published Japanese translation 2004-534797 of a PCTapplication, JP-A-2007-231000, JP-A-2009-134289, and paragraphs 0046 to0059 of International Laid-open Patent No. 2012/057165 may be used.

Specific examples of the organic halide compound include compoundsdescribed in Wakabayashi et al., ‘Bull Chem. Soc. Japan’, 42, 2924(1969), U.S. Pat. No. 3,905,815, JP-B-46-4605, JP-A-48-36281,JP-A-55-32070, JP-A-60-239736, JP-A-61-169835, JP-A-61-169837, JP-A-62-58241, JP-A-62-212401, JP-A-63-70243, JP-A-63-298339, M. P. Hutt,et al., Journal of Heterocyclic Chemistry, Vol. 7, Issue 3, 511-518(1970), etc.; an oxazole compound substituted with a trihalomethyl groupand an s-triazine compound may in particular be cited.

Examples of the hexaaryl biimidazole compound include various compoundsdescribed in JP-B-6-29285, U.S. Pat. Nos. 3,479,185, 4,311,783,4,622,286, etc.

Examples of the acylphosphine (oxide) compound include amonoacylphosphine oxide compound and a bisacylphosphine oxide compound,and specific examples include Irgacure 819, Darocur 4265, and DarocurTPO from BASF.

With regard to the photopolymerization initiator, one type may be usedor two or more types may be used in combination.

The content of the photopolymerization initiator in the composition forformation of a protective layer is preferably 0.5 to 30 parts by massrelative to 100 parts by mass of the total solids content of thecomposition, more preferably 1 to 20 parts by mass, yet more preferably1 to 10 parts by mass, and particularly preferablyl.5 to 5 parts bymass.

Component G: Solvent

The composition for formation of a protective layer may comprise asComponent G a solvent. The composition for formation of a protectivelayer is preferably prepared as a liquid in which the above componentsand an optional component, which is further described later, aredissolved and/or dispersed in a solvent.

As the solvent used in the composition for formation of a protectivelayer, a known solvent may be used, and examples include an ethyleneglycol monoalkyl ether, an ethylene glycol dialkyl ether, an ethyleneglycol monoalkyl ether acetate, a propylene glycol monoalkyl ether, apropylene glycol dialkyl ether, a propylene glycol monoalkyl etheracetate, a diethylene glycol dialkyl ether, a diethylene glycolmonoalkyl ether acetate, a dipropylene glycol monoalkyl ether, adipropylene glycol dialkyl ether, a dipropylene glycol monoalkyl etheracetate, an ester, a ketone, an amide, and a lactone. Solvents describedin paragraphs 0174 to 0178 of JP-A-2011-221494 may also be cited asexamples.

In addition to these solvents, as necessary, a solvent such as benzylethyl ether, dihexyl ether, ethylene glycol monophenyl ether acetate,diethylene glycol monomethyl ether, diethylene glycol monoethyl ether,isophorone, caproic acid, caprylic acid, 1-octanol, 1-nonanol, benzylalcohol, anisole, benzyl acetate, ethyl benzoate, diethyl oxalate,diethyl maleate, ethylene carbonate, or propylene carbonate may beadded.

With regard to these solvents, one type may be used on its own or two ormore types may be used in combination. With regard to solvents that canbe used in the present invention, it is preferable to use one type onits own or two types in combination.

It is also preferable for Component G to be a solvent having a boilingpoint of at least 130° C. but less than 160° C., a solvent having aboiling point of at least 160° C., or a mixture thereof.

Examples of solvents having a boiling point of at least 130° C. but lessthan 160° C. include propylene glycol monomethyl ether acetate (boilingpoint 146° C.), propylene glycol monoethyl ether acetate (boiling point158° C.), propylene glycol methyl n-butyl ether (boiling point 155° C.),and propylene glycol methyl n-propyl ether (boiling point 131° C.).

Examples of solvents having a boiling point of at least 160° C. includeethyl 3-ethoxypropionate (boiling point 170° C.), diethylene glycolmethyl ethyl ether (boiling point 176° C.), propylene glycol monomethylether propionate (boiling point 160° C.), dipropylene glycol methylether acetate (boiling point 213° C.), 3-methoxybutyl ether acetate(boiling point 171° C.), diethylene glycol diethyel ether (boiling point189° C.), diethylene glycol dimethyl ether (boiling point 162° C.),propylene glycol diacetate (boiling point 190° C.), diethylene glycolmonoethyl ether acetate (boiling point 220° C.), dipropylene glycoldimethyl ether (boiling point 175° C.), and 1,3-butylene glycoldiacetate (boiling point 232° C.).

Among them, the solvent is preferably a propylene glycol monoalkyl etheracetate, and particularly preferably propylene glycol monomethyl etheracetate.

The content of the solvent in the composition for formation of aprotective layer is preferably at least 20 mass % but no greater than 95mass %, more preferably at least 50 mass % but no greater than 95 mass%, and yet more preferably at least 65 mass % but no greater than 95mass %. When the content of the solvent is in this range, the coatingproperties and the flatness during coating are good.

Component H: Alkoxysilane Compound

The composition for formation of a protective layer preferably comprisesas Component H an alkoxysilane compound. When an alkoxysilane compoundis used, adhesion between a film formed from the composition forformation of a protective layer and a support, etc. can be improved.

The alkoxysilane compound is not particularly limited as long as it is acompound having at least one alkoxy group directly bonded to a siliconatom, but is preferably a dialkoxysilyl group- and/or trialkoxysilylgroup-containing compound, and more preferably a trialkoxysilylgroup-containing compound.

The alkoxysilane compound that can be used in the present invention ispreferably a compound that improves adhesion between a cured film and asubstrate such as a silicon compound such as silicon, silicon oxide, orsilicon nitride, or a metal such as gold, copper, molybdenum, titanium,or aluminum. Specifically, a known silane coupling agent, etc. is alsoeffective. A silane coupling agent having an ethylenically unsaturatedbond is preferable.

Examples of the silane coupling agent includeγ-aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, aγ-glycidoxypropyltrialkoxysilane, a γ-glycidoxypropyldialkoxysilane, aγ-methacryloxypropyltrialkoxysilane, aγ-methacryloxypropyldialkoxysilane, a γ-chloropropyltrialkoxysilane, aγ-mercaptopropyltrialkoxysilane, aβ-(3,4-epoxycyclohexyl)ethyltrialkoxysilane, and a vinyltrialkoxysilane.Among them, a γ-methacryloxypropyltrialkoxysilane, aγ-acryloxypropyltrialkoxysilane, a vinyltrialkoxysilane, and aγ-glycidoxypropyltriacoxysilane are more preferable. With regard tothese, one type may be used on its own or two or more types may be usedin combination.

Examples of commercial products include KBM-403 and KBM-5103manufactured by Shin-Etsu Chemical Co., Ltd.

The content of the alkoxysilane compound in the composition forformation of a protective layer is preferably 0.1 to 30 mass % relativeto the total solids content of the composition, more preferably 2 to 20mass %, and yet more preferably 3 to 10 mass %. With regard to thealkoxysilane compound, one type may be used on its own or two or moretypes may be used in combination. When two or more types are used, thetotal amount is preferably in the above range

Component I: Basic Compound

The composition for formation of a protective layer, in particular thepositive-working photosensitive composition, preferably comprises abasic compound from the viewpoint of liquid storage stability.

Any basic compound may be selected from those used in a chemicallyamplified resist and used. Examples include an aliphatic amine, anaromatic amine, a heterocyclic amine, a quaternary ammonium hydroxide,and a quaternary ammonium salt of a carboxylic acid.

Examples of the basic compound include compounds described in paragraph0169 of JP-A-2014-10200.

With regard to the basic compound that can be used in the presentinvention, one type thereof may be used on its own or two or more typesmay be used in combination, but it is preferable to use two or moretypes in combination, it is more preferable to use two types incombination, and it is yet more preferable to use two types ofheterocyclic amines in combination.

The content of the basic compound in the composition for formation of aprotective layer is preferably 0.001 to 1 mass % relative to the totalorganic solids content of the composition, and more preferably 0.002 to0.5 mass %.

Component J: Surfactant

The composition for formation of a protective layer of the presentinvention may comprise a surfactant.

As the surfactant, any of anionic, cationic, nonionic, or amphotericsurfactants may be used, but a nonionic surfactant is preferable. Thesurfactant is preferably a nonionic surfactant, and more preferably afluorine-based surfactant.

Preferred examples of the surfactant also include compounds described inparagraphs 0119 to 0123 of JP-A-2014-238438.

When added, the content of the surfactant in the composition forformation of a protective layer is preferably 0.001 to 5.0 mass %relative to the total solids content of the composition, and morepreferably 0.01 to 2.0 mass %.

With regard to the surfactant, only one type may be contained or two ormore types may be contained. When two or more types are contained, thetotal amount is preferably in the above range.

Component K: Thermal Crosslinking Agent

The composition for formation of a protective layer preferably comprisesa thermal crosslinking agent as necessary. Due to a thermal crosslinkingagent being added, a cured film obtained using the composition forformation of a protective layer can be made stronger.

The thermal crosslinking agent is not limited as long as it can cause acrosslinking reaction upon heating (however, Component A to Component Cand Component E are excluded). Examples include a compound containing atleast two epoxy groups or oxetanyl groups per molecule described inparagraphs 0188 to 0191 of JP-A-2011-221494, an alkoxymethylgroup-containing crosslinking agent described in paragraphs 0192 to 0194of JP-A-2011-221494, a compound having at least one ethylenicallyunsaturated double bond, or a blocked isocyanate compound described inparagraphs 0147 to 0149 of JP-A-2012-208200.

The amount of thermal crosslinking agent added in the composition forformation of a protective layer is preferably 0.01 to 50 parts by massrelative to 100 parts by mass of the total solids content of thecomposition, more preferably 0.1 to 30 parts by mass, and yet morepreferably 0.5 to 20 parts by mass. Due to it being added in this range,a cured film having excellent mechanical strength and solvent resistanceis obtained. With regard to the thermal crosslinking agent, a pluralitythereof may be used in combination, and in this case the content iscalculated by adding the contents of all the thermal crosslinkingagents.

Component L: Heterocyclic Compound having Two or more Nitrogen Atoms

When a3 is used as Component A, the composition for formation of aprotective layer preferably comprises as Component L a heterocycliccompound having two or more nitrogen atoms from the viewpoint ofreduction in haze.

Component L is not particularly limited as long as it has two or morenitrogen atoms, but it is preferable for it to be a heterocycliccompound having two or more nitrogen atoms as members of a heterocyclicring, more preferably a compound having a heterocyclic structure havingnitrogen atoms at 1- and 3-positions, and yet more preferably a compoundhaving a 5-membered or 6-membered heterocyclic structure having nitrogenatoms at 1- and 3-positions.

Examples of the basic compound include compounds described in paragraph0168 to 0182 of JP-A-2014-238438, and preferred embodiments described inparagraph 0168 to 0182 of JP-A-2014-238438 can be referred.

With regard to Component L, one type thereof may be used on its own ortwo or more types may be used in combination.

The content of Component L in the composition for formation of aprotective layer is preferably 0.1 to 20 mass % relative to the totalsolids content of the composition, more preferably 0.5 to 15 mass %, andyet more preferably 0.5 to 10 mass %. When in this range, a curedmaterial having better dispersibility for inorganic particles and lowerhaze can be obtained.

—Antioxidant—

The composition for formation of a protective layer preferably comprisesan antioxidant.

As the antioxidant, a known antioxidant may be contained. Due to anantioxidant being added, there are the advantages that coloration of acured film can be prevented, reduction in film thickness due todecomposition can be suppressed, and the heat-resistant transparency isexcellent.

Examples of such an antioxidant include a phosphorus-based antioxidant,an amide, a hydrazide, a hindered amine-based antioxidant, asulfur-based antioxidant, a phenol-based antioxidant, an ascorbic acid,zinc sulfate, a saccharide, a nitrite, a sulfite salt, a thiosulfate,and a hydroxylamine derivative. Among them, from the viewpoint ofcoloration of a cured film and reduction in film thickness, a phenolicantioxidant, an amide-based antioxidant, a hydrazide-based antioxidant,and a sulfur-based antioxidant are particularly preferable. With regardto these, one type may be used on its own or two or more types may bemixed.

Examples of the antioxidant include compounds described in paragraph0066 to 0093 of Japanese registered patent No. 5306903 and compoundsdescribed in paragraph 0178 of JP-A-2014-10200.

The content of the antioxidant is preferably 0.1 to 10 mass % relativeto the total solids content of the composition, more preferably 0.2 to 5mass %, and particularly preferably 0.5 to 4 mass %. With this range, afilm that is formed has sufficient transparency and good sensitivitywhen forming a pattern.

Furthermore, as an additive other than an antioxidant, various types ofUV absorber or metal deactivating agent, etc. described in “KobunshiTenkazai no Shintenkai (New Developments in Polymer Additives)” (TheNikkan Kogyo Shimbun, Ltd.) may be added to the composition forformation of a protective layer.

—Dispersant—

The composition for formation of a protective layer preferably comprisesa dispersant. Due to it comprising a dispersant, the dispersibility ofComponent A, in particular a3, in the composition can be improved.

A known dispersant may be used as the dispersant; for example, a knownpigment dispersing agent may be appropriately selected and used.

As the dispersant, for example, a known pigment dispersing agent may beappropriately selected and used.

Furthermore, as the dispersant, a polymeric dispersant may preferably beused. The polymeric dispersant referred to here is a dispersant having amolecular weight (weight-average molecular weight) of at least 1,000.

Examples of the antioxidant include compounds described in paragraph0199 to 0213 of International Patent Laid-open No. 2014/003111 andcompounds described in paragraph 0154 to 0233 of International PatentLaid-open No. 2014/199967.

With regard to the dispersant, one type thereof may be used on its ownor two or more types may be used in combination.

The content of the dispersant in the composition for formation of aprotective layer is preferably in the range of 5 to 70 mass % relativeto the total solids content of the composition, and more preferably inthe range of 10 to 50 mass %.

—Polymerization Inhibitor—

The composition for formation of a protective layer may comprise apolymerization inhibitor. Due to it comprising a polymerizationinhibitor, a polymerization reaction due to the leakage of light issuppressed, and the developability is excellent.

The polymerization inhibitor referred to here is a substance thatcarries out hydrogen supply (or the imparting of hydrogen), energysupply (or the imparting of energy), electron supply (or the impartingof an electron), etc. to a polymerization-initiating radical componentgenerated from a polymerization initiator upon exposure or heat to thusdeactivate a polymerization-initiating radical and inhibit initiation ofpolymerization. For example, compounds described in paragraphs 0154 to0173 of JP-A-2007-334322, etc. may be used.

The content of the polymerization inhibitor in the composition forformation of a protective layer is not particularly limited but ispreferably 0.005 to 0.5 mass % relative to the total solids content ofthe composition, and more preferably 0.01 to 0.5 mass %. Adjusting theamount of polymerization inhibitor added enables the patterningproperties to be improved without impairing the sensitivity.

—Other Components—

In addition to the above components, the composition for formation of aprotective layer may comprise as necessary another component such as asensitizer, an adhesion-improving agent, an acid-increasing agent, adevelopment accelerator, a plasticizer, a thickener, or an organic orinorganic precipitation inhibitor. As these components, those describedin for example JP-A-2014-235216, JP-A-2009-98616, JP-A-2009-244801, andJP-A-2011-221494 and other known components may be used.

Furthermore, as another additive, a thermal radical generator describedin paragraphs 0120 to 0121 of JP-A-2012-8223 and a nitrogen-containingcompound and a thermal acid generator described in International PatentLaid-open No. 2011/136074 may be used.

A method for forming each layer of the protective layer using thecomposition for formation of a protective layer is not particularlylimited, and can be use a known method, and is preferably a method ofcoating, and exposure, developing and/or heat treatment as necessary.

A method for applying the composition for formation of a protectivelayer is not particularly limited, and examples include a slit coatingmethod, a spray method, a roll coating method, a spin coating method, acast coating method, a slit-and-spin method, an inkjet method, and aprinting method (flexographic, gravure, screen, etc.). An inkjet methodand a printing method are preferable since a composition can be placedonly in a necessary location, thus preventing the composition beingwasted.

Among them, the composition for formation of a protective layer is usedsuitably in a printing method and an inkjet method, and particularlysuitably in a screen printing method and an inkjet method.

Furthermore, before coating a support with the composition for formationof a protective layer, a so-called pre-wetting method as described inJP-A-2009-145395 may be applied.

When the composition for formation of a protective layer comprises asolvent, it is preferable to carry out drying. As a drying method, amethod in which solvent is removed from a coated composition film bymeans of pressure reduction (vacuum) and/or heating, etc. to thus form adry coating on a substrate can be cited as a preferred example. Heatingconditions when drying are preferably on the order of 70° C. to 130° C.and 30 to 300 seconds.

Coating and drying may be carried out in that order, at the same time,or repeatedly in turn. For example, drying may be carried out afterinkjet coating is completely finished, or a support may be heated anddrying may be carried out while discharging a composition by means of aninkjet coating method.

Exposure involves generating an acid and/or a polymerization initiatingspecies from a photo-acid generator and/or a photopolymerizationinitiator using actinic radiation and decomposing an acid-decomposablegroup by the acid and/or polymerizing an ethylenically unsaturatedcompound, etc.

As an exposure light source, a low-pressure mercury lamp, a highpressure mercury lamp, an ultra high-pressure mercury lamp, a chemicallamp, an LED light source, an excimer laser generator, etc. may be used,and actinic radiation having a wavelength of at least 300 nm but nogreater than 450 nm such as i-line (365 nm), h-line (405 nm), or g-line(436 nm) may preferably be used. The irradiating light may be adjustedas necessary by way of a spectral filter such as a long wavelength cutfilter, a short wavelength cut filter, or a band-pass filter.

As exposure equipment, various types of exposure equipment such as amirror projection aligner, a stepper, a scanner, proximity, contact, amicrolens array, a lens scanner, and laser exposure may be used.

The amount of exposure in the exposure step is not particularly limited,but is preferably 1 to 3,000 mJ/cm², and more preferably 1 to 500mJ/cm².

Exposure may be carried out in a state in which there is an oxygenbarrier. Examples of oxygen barrier means include exposing under anatmosphere of nitrogen and providing an oxygen barrier film.

Exposure may be carried out for at least part of the composition, andfor example it may be whole face exposure or pattern exposure.

It is also possible to carry out, after exposure, a post-exposureheating treatment: Post Exposure Bake (hereinafter, also called ‘PEB’).The temperature when PEB is carried out is preferably at least 30° C.but no greater than 130° C., more preferably at least 40° C. but nogreater than 120° C., and particularly preferably at least 50° C. but nogreater than 110° C.

The heating method is not particularly limited, and a known method maybe used. Examples include a hotplate, an oven, and an infrared heater.

The heating time is preferably on the order of 1 minute to 30 minutes inthe case of a hotplate, and preferably on the order of 20 minutes to 120minutes in other cases. With this range, it is possible to carry outheating without damaging the substrate or the equipment.

The formation of each layer of the protective layer may furthercomprise, as necessary, a development step of developing the exposedlayer using a developer.

In the development step, a curable composition that has been patternwiseexposed is developed using a solvent or an alkaline developer to thusform a pattern. The developer used in the development step preferablycomprises a basic compound. As the basic compound, an aqueous solutionof an alkali metal hydroxide such as lithium hydroxide, sodiumhydroxide, or potassium hydroxide; an alkali metal carbonate such assodium carbonate or potassium carbonate; an alkali metal bicarbonatesuch as sodium bicarbonate or potassium bicarbonate; an ammoniumhydroxide such as tetramethylammonium hydroxide, tetraethylammoniumhydroxide, tetrapropylammonium hydroxide, tetrabutylammonium hydroxide,benzyltrimethylammonium hydroxide, or choline hydroxide; or sodiumsilicate, sodium metasilicate, etc. may be used. It is also possible touse as the developer an aqueous solution obtained by adding anappropriate amount of a surfactant or a water-soluble organic solventsuch as methanol or ethanol to the above aqueous solution of an alkali.

Preferred examples of the developer include a 0.4 to 2.5 mass % aqueoussolution of tetramethylammonium hydroxide.

The pH of the developer is preferably 10.0 to 14.0. The development timeis preferably 30 to 500 sec., and the method for development may be anyof a liquid-puddle method (puddle method), a shower method, a dipmethod, etc.

A rinsing step may be carried out after development. In the rinsingstep, removal of attached developer and removal of development residueare carried out by washing the substrate with pure water, etc. afterdevelopment. As a rinsing method, a known method may be used. Examplesinclude shower rinsing and dip rinsing.

With regard to pattern exposure and development, a known method and aknown developer may be used. For example, a pattern exposure method anda development method described in JP-A-2011-186398 and JP-A-2013-83937may suitably be used.

After the exposure described above, an exposed layer may be carried outa heat treatment. Carrying out a heat treatment after exposure enables acured film having excellent strength to be obtained.

The temperature of the heat treatment is preferably 80° C. to 300° C.,more preferably 100° C. to 280° C., and particularly preferably 120° C.to 250° C. With this embodiment, it is surmised that, when a1 and/or a2is used as Component A, condensation of Component A progresses to anappropriate degree, and the physical properties of a cured film areimproved.

Furthermore, the time for the heat treatment is not particularlylimited, but it is preferably 1 minute to 360 minutes, more preferably 5minutes to 240 minutes, and yet more preferably 10 minutes to 120minutes.

Curing by means of light and/or heat in the process for producing acured film of the present invention may be carried out continuously orin succession.

When a heat treatment is carried out, the transparency may be improvedby carrying it out under an atmosphere of nitrogen.

A heat treatment step may also be carried out after carrying out bakingat a relatively low temperature prior to the heat treatment step(post-bake) (addition of a middle-bake step). When a middle-bake iscarried out, it is preferable to carry out heating at 90° C. to 150° C.for 1 to 60 minutes, and after that a post-bake is carried out at 120°C. to 300° C.

It is also possible to carry out middle-bake and post-bake heating inmultiple stages of three or more stages. Designing the middle-bake andpost-bake in this way enables the taper angle of a pattern to beadjusted. The above heating may be carried out by using a known heatingmethod such as a hotplate, an oven, or an infrared heater.

Prior to the post-bake, the whole face of a substrate on which a patternhas been formed is re-exposed to actinic radiation (post-exposure), andthen is subjected to a post-bake; it is surmised that initiating speciesare thereby generated by a condensation reaction of each componentitself and/or thermal decomposition of photopolymerization initiatorremaining in an exposed area and are made to function as a catalyst forpromoting a crosslinking step, thus promoting film curing. The amount ofexposure when the post-exposure step is included is preferably 100 to3,000 mJ/cm², and particularly preferably 100 to 500 mJ/cm².

(Transfer Material)

The touch panel member of the present invention may be formed by filmtransfer of the protective layer and is preferably one prepared usingthe transfer material of the present invention, which is shown below.

The transfer material of the present invention comprises three or morelayers having different refractive indices on a temporary support, eachof the layers having different refractive indices satisfying Expression1′, and each of the layers having different refractive indicessatisfying Expression 3′ below.

0<n(x′)−n(x′+1)≦0.20   (1′)

0.20≦n(1)−n(N′)   (3′)

In the Expressions, the layers having different refractive indices aredesignated, starting from the layer that is the farthest from thetemporary support, as the 1st layer, the 2nd layer, and so on, the layerthat is the closest to the temporary support is designated as the N′thlayer, the refractive index of an a′th layer among the layers havingdifferent refractive indices is defined as n(a′), a′ denotes an integersatisfying 1≦a′≦N, and x′ denotes an integer satisfying 1≦x′≦N′−1.

For example, the touch panel member of the present invention ispreferably formed by transferring the three or more layers havingdifferent refractive indices as a protective layer from the transfermaterial of the present invention onto a substrate and then removing thetemporary support.

A preferred embodiment of the three or more layers having differentrefractive indices in the transfer material is the same as the preferredembodiment of the three or more layers having different refractiveindices in the protective layer.

A preferred embodiment of Expression 1′ is the same as a preferredembodiment of Expression 1 in which x is replaced by x′.

A preferred embodiment of Expression 3′ is the same as a preferredembodiment of Expression 3 in which N is replaced by N′.

—Temporary Support—

The transfer material comprises a temporary support.

The temporary support preferably has flexibility. It is preferable thatwhen applying pressure or when heating and applying pressure,deformation, shrinkage, or stretching do not occur to a great extent.Examples of such a temporary support include a polyethyleneterephthalate film, a cellulose triacetate film, a polystyrene film, anda polycarbonate film, and among them a biaxially stretched polyethyleneterephthalate film is particularly preferable.

The thickness of the temporary support is not particularly limited butis preferably 5 to 300 μm, and more preferably 20 to 200 μm.

The temporary support may be transparent or may contain dyed silicon, analumina sol, a chromium salt, a zirconium salt, etc.

A conductive layer or a hydrophobic polymer layer may be imparted to thetemporary support by a method described in paragraphs 0079 to0095JP-A-2005-221726, etc.

—Thermoplastic Resin Layer—

The transfer material may have at least one thermoplastic resin layer.The thermoplastic resin layer is preferably provided between thetemporary support and the three or more layers having differentrefractive indices. That is, the transfer material preferably comprises,in order, the temporary support, the thermoplastic resin layer, and thethree or more layers having different refractive indices.

A component used in the thermoplastic resin layer is particularlypreferably selected from organic polymers having a softening point ofabout 80° C. or below by the Vicat method (specifically, a polymersoftening point measurement method in accordance with ASTMD1235 of theAmerican Society for Testing and Materials).

Specific examples include organic polymers such as a polyolefin such aspolyethylene or polypropylene, an ethylene copolymer between ethyleneand vinyl acetate or a saponified product thereof, ethylene and anacrylic acid ester or a saponified product thereof, polyvinyl chloride,a vinyl chloride copolymer between vinyl chloride and vinyl acetate or asaponified product thereof, polyvinylidene chloride, a vinylidenechloride copolymer, polystyrene, a styrene copolymer between styrene anda (meth)acrylic acid ester or a saponified product thereof,polyvinyltoluene, a vinyltoluene copolymer between vinyltoluene and a(meth)acrylic acid ester or a saponified product thereof, apoly(meth)acrylic acid ester, a (meth)acrylic acid ester copolymerbetween butyl (meth)acrylate and vinyl acetate, etc., and a polyamideresin such as a vinyl acetate copolymer nylon, a copolymer nylon, anN-alkoxymethylated nylon or an N-dimethylaminated nylon.

The thickness of the thermoplastic resin layer is preferably 6 to 100μm, and more preferably 6 to 50 μm. When the thickness of thethermoplastic resin layer is in the range of 6 to 100 μm, even if thereare asperities on the substrate, the influence of the asperities can beabsorbed.

—Intermediate Layer—

The transfer material may comprise an intermediate layer for the purposeof preventing components from being mixed when applying a plurality ofcoating layers or when storing a transfer material after coating. Theintermediate layer is preferably provided between the temporary supportand the three or more layers having different refractive indices(between the thermoplastic resin layer and the three or more layershaving different refractive indices when there is the thermoplasticresin layer). That is, the transfer material preferably comprises, inorder, the temporary support, the thermoplastic resin layer, theintermediate layer, and the three or more layers having differentrefractive indices.

The intermediate layer is preferably an oxygen-blocking film, which hasan oxygen-blocking function, and is described as a ‘separation layer’ inJP-A-5-72724; in this case, the sensitivity at the time of exposureincreases, the time load on exposure equipment decreases, and theproductivity improves.

The oxygen-blocking film is preferably one that shows low oxygenpermeability and that is dispersed or dissolved in water or an alkaliaqueous solution, and may be selected as appropriate from known films.Among them, a combination of polyvinyl alcohol and polyvinylpyrrolidoneis particularly preferable.

The thickness of the intermediate layer is preferably 0.1 to 5.0 μm, andmore preferably 0.5 to 2.0 μm. When in the range of 0.1 to 5.0 μm, theoxygen-blocking ability does not decrease, and the time taken fordevelopment or removal of the intermediate layer is not too long.

—Protective Peel-Off Layer—

It is preferable to provide the transfer material with a protectivepeel-off layer (also called a cover film) so as to cover the three ormore layers having different refractive indices in order to protect forpollution and damage in conserving the transfer material. The protectivepeel-off layer may be formed from the same material as or a similarmaterial to that of the temporary support, but should be easilyseparated from an uncured layer. As a material for the protectivepeel-off layer, for example, a silicone paper or a polyolefin orpolytetrafluoroethylene sheet is appropriate.

The maximum value of the haze of the protective peel-off layer ispreferably no greater than 3.0%, and from the viewpoint of suppressingmore effectively the occurrence of post-development defects in the threeor more layers having different refractive indices, it is preferably nogreater than 2.5%, more preferably no greater than 2.0%, andparticularly preferably no greater than 1.0%.

The thickness of the protective peel-off layer is preferably 1 to 100μm, more preferably 5 to 50 μm, and particularly preferably 10 to 30 μm.When this thickness is at least 1 μm, the strength of the protectivepeel-off layer is sufficient and the layer is resistant to tearing, andwhen it is no greater than 100 μm, the cost of the protective peel-offlayer is not high, and the protective peel-off layer is resistant tocreasing when laminating.

With regard to the protective peel-off layer, examples of commerciallyavailable ones include, but are not limited to, Alphan MA-410, E-200C,and E-501 manufactured by Oji Paper Co., Ltd., a polypropylene filmmanufactured by Shin-Etsu Film Co., Ltd., and a polyethyleneterephthalate film of the PS series such as PS-25 manufactured by TeijinLimited. It is also possible to simply produce one by subjecting acommercially available film to sandblasting.

As the protective peel-off layer, a polyolefin film such as apolyethylene film may be used. A polyolefin film that is used as aprotective peel-off layer may suitably be produced by thermally meltingstarting materials and kneading, extruding, biaxially stretching,casting, or inflating.

—Process for Producing Transfer Material—

A method for producing the transfer material is not particularlylimited, and a known method may be used.

Furthermore, a method for forming three or more layers having differentrefractive indices in the transfer material may suitably employ themethod described above.

As a method for coating a temporary support with a coating solution forformation of the above thermoplastic resin layer and a coating solutionfor formation of the above intermediate layer, a known coating methodmay be used. For example, they may be formed by applying the coatingsolutions using a coating machine such as a spinner, a whirler, a rollercoater, a curtain coater, a knife coater, a wire bar coater, or anextruder, followed by drying.

—Solvent—

The coating solution for formation of a thermoplastic resin layer andthe coating solution for formation of an intermediate layer may beprepared suitably by the use of a solvent together with each of thecomponents.

Examples of the solvent include an ester such as for example ethylacetate, n-butyl acetate, isobutyl acetate, amyl formate, isoamylacetate, isobutyl acetate, butyl propionate, isopropyl butyrate, ethylbutyrate, butyl butyrate, an alkyl ester, methyl lactate, ethyl lactate,methyl oxyacetate, ethyl oxyacetate, butyl oxyacetate, methylmethoxyacetate, ethyl methoxyacetate, butyl methoxyacetate, methylethoxyacetate, or ethyl ethoxyacetate, a 3-oxypropionic acid alkyl estersuch as a methyl 3-oxypropionate or an ethyl 3-oxypropionate (forexample, methyl 3-methoxypropionate, ethyl 3-methoxypropionate, methyl3-ethoxypropionate, or ethyl 3-ethoxypropionate), a 2-oxypropionic acidalkyl ester such as a methyl 2-oxypropionate, an ethyl 2-oxypropionate,or a propyl 2-oxypropionate (for example, methyl 2-methoxypropionate,ethyl 2-methoxypropionate, propyl 2-methoxypropionate, methyl2-ethoxypropionate, ethyl 2-ethoxypropionate, methyl2-oxy-2-methylpropionate, ethyl 2-oxy-2-methylpropionate, methyl2-methoxy-2-methylpropionate, or ethyl 2-ethoxy-2-methylpropionate),methyl pyruvate, ethyl pyruvate, propyl pyruvate, methyl acetoacetate,ethyl acetoacetate, methyl 2-oxobutanoate, or ethyl 2-oxobutanoate; anether such as for example diethylene glycol dimethyl ether,tetrahydrofuran, ethylene glycol monomethyl ether, ethylene glycolmonoethyl ether, methyl cellosolve acetate, ethyl cellosolve acetate,diethylene glycol monomethyl ether, diethylene glycol monoethyl ether,diethylene glycol monobutyl ether, propylene glycol monomethyl etheracetate, propylene glycol monoethyl ether acetate, or propylene glycolpropyl ether acetate; a ketone such as for example methyl ethyl ketone,methyl isobutyl ketone, cyclohexanone, 2-heptanone, or 3-heptanone; andan aromatic hydrocarbon such as for example toluene or xylene.

Among them, methyl ethyl ketone, methyl isobutyl ketone, xylene,cyclohexanone, propylene glycol monomethyl ether, propylene glycolmonomethyl ether acetate, etc. are desirable.

The solvent may be used on its own or two or more types may be used incombination.

A method for covering the three or more layers having differentrefractive indices with the protective peel-off layer is notparticularly limited, and a method in which the protective peel-offlayer is superimposed and compression-bonded to the three or more layershaving different refractive indices above a temporary support may beused.

The compression bonding may employ a known laminator such as alaminator, a vacuum laminator, or an auto cut laminator, which canfurther enhance productivity.

The conditions for compression bonding are preferably an atmospherictemperature of 20° C. to 45° C. and a line pressure of 1,000 to 10,000N/m.

—Lamination Method—

Transfer (lamination) of the three or more layers having differentrefractive indices onto a substrate surface is carried out bysuperimposing the three or more layers having different refractiveindices onto a substrate surface and applying pressure and heat.Lamination may employ a known laminator such as a laminator, a vacuumlaminator, or an auto cut laminator, which can further enhanceproductivity.

The lamination method may be either a continuous type or a single sheettype, but a single sheet type is preferable in terms of bubbles notentering between a transfer material and a substrate when transferring astamped-out transfer material onto the substrate. Specifically, a methodemploying a vacuum laminator is preferable.

Examples of equipment used for lamination (continuous type/single sheettype) include a V-SE340aaH manufactured by Climb Products.

Examples of the vacuum laminator include one manufactured by TakanoSeiki Co., Ltd., and the FVJ-540R and FV700 manufactured by TaiseiLaminator Co., Ltd.

It is preferable for there to be included, prior to affixing thetransfer material to the substrate, a step of layering a support on theside of the temporary support opposite to the three or more layershaving different refractive indices, since it makes it harder forbubbles to enter during lamination. Examples of the support used hereinclude, without being particularly limited to, those below.

The film thickness of the support is preferably in the range of 50 to200 μm.

—Step of Removing Temporary Support—

A process for producing the transfer material preferably comprises astep of removing the temporary support from the transfer materialaffixed to the substrate.

—Step of Removing Thermoplastic Resin Layer and Step of RemovingIntermediate Layer—

Furthermore, when the transfer material comprises a thermoplastic resinlayer or an intermediate layer, it is preferable for there to beincluded a step of removing the thermoplastic resin layer and/or theintermediate layer.

The step of removing the thermoplastic resin layer and/or theintermediate layer may be carried out using an alkali developer that isusually used for a photolithographic method. The alkali developer is notparticularly limited, and the developer described above or a knowndeveloper such as one described in JP-A-5-72724 may be used. With regardto the developer, one in which a layer to be developed shows dissolutiondevelopment behavior is preferable, and one comprising a compound havingfor example a pKa of 7 to 13 at 0.05 to 5 mol/L is preferable.Furthermore, a small amount of organic solvent that is miscible withwater may be added. Examples of the organic solvent having miscibilitywith water include methanol, ethanol, 2-propanol, 1-propanol, butanol,diacetone alcohol, ethylene glycol monomethyl ether, ethylene glycolmonoethyl ether, ethylene glycol mono-n-butyl ether, benzyl alcohol,acetone, methyl ethyl ketone, cyclohexanone, ε-caprolactone,γ-butyrolactone, dimethylformamide, dimethylacetamide,hexamethylphosphoramide, ethyl lactate, methyl lactate, ε-caprolactam,and N-methylpyrrolidone. The concentration of the organic solvent ispreferably 0.1 mass % to 30 mass %.

The alkali developer may further comprise a known surfactant. Theconcentration of the surfactant is preferably 0.01 mass % to 10 mass %.

As a method for the step of removing a thermoplastic resin layer and/oran intermediate layer, any of a puddle method, a shower method, a shower& spin method, a dip method, etc. may be used. The shower method isexplained here; a thermoplastic resin layer or an intermediate layer maybe removed by spraying a developer thereonto using a shower.Furthermore, after development it is preferable to remove residue byspraying a washing agent, etc. using a shower and rubbing with a brush.The liquid temperature is preferably 20° C. to 40° C. and the pH ispreferably 8 to 13.

—Post-Baking Step—

It is preferable for there to be included a post-baking step after thetransfer step. It is more preferable for there to be included a step ofcarrying out post-baking after the step of removing a thermoplasticresin layer and an intermediate layer.

From the viewpoint of productivity, the post-baking step is preferablycarried out by heating at 50° C. to 300° C. under an environment of 0.08to 1.2 atm. Here, 1 atm=101,325 Pa (atmospheric pressure).

Heating of the post-baking is more preferably carried out under anenvironment of 0.5 atm or greater. The upper limit is more preferablyunder an environment of 1.1 atm or below, and particularly preferablyunder an environment of 1.0 atm or below. Furthermore, from theviewpoint of reduction of production costs without using specialpressure-reducing equipment, it is particularly preferable to carry itout under an environment of 1 atm (atmospheric pressure).

The temperature of the post-baking is preferably 50° C. to 300° C., morepreferably 100° C. to 300° C., and yet more preferably 120° C. to 300°C.

It is also possible to carry out the post-baking at two or moredifferent temperatures for respective predetermined times. For example,heating is first carried out at 50° C. to 200° C., and preferably 100°C. to 200° C., and subsequently heating is carried out at 200° C. to280° C., and preferably 220° C. to 260° C.

The time of the post-baking is more preferably 20 to 150 minutes, andparticularly preferably 30 to 100 minutes. When it is carried out in twoor more temperature stages, it is preferably carried out for a total of20 to 150 minutes of the respective temperature stages.

The post-baking may be carried out under an environment of air or undera nitrogen-purged environment, but it is particularly preferable tocarry it out under an environment of air in terms of the productioncosts being reduced without using special pressure-reducing equipment.

—Other Step—

The process for producing the transfer material may comprise anotherstep, such as a post-exposure step.

As an example of the post-exposure step, the development step, the stepof removing a thermoplastic resin layer and/or an intermediate layer,and another step, a method described in paragraphs 0035 to 0051 ofJP-A-2006-23696 may also be suitably used in the present invention.

(Touch Panel and Touch Panel Display Device)

The touch panel of the present invention comprises the touch panelmember of the present invention.

The touch panel display device of the present invention comprises thetouch panel member of the present invention.

As a detection method, various known types of methods such as acapacitance method, a resistive film method, or an optical method may beemployed. Among them, a capacitance method is preferable.

As a touch panel type, the so-called in-cell type (for example, thoseshown in FIG. 5, FIG. 6, FIG. 7, and FIG. 8 of published Japanesetranslation 2012-517051 of a PCT application), the so-called on-celltype (for example, one shown in FIG. 19 of JP-A-2013-168125, those shownin FIG. 1 and FIG. 5 of JP-A-2012-89102), an OGS (One Glass Solution)type, a TOL (Touch-on-Lens) type (for example, one shown in FIG. 2 ofJP-A-2013-54727), another constitution (for example, one shown in FIG. 6of JP-A-2013-164871), and various kinds of out-cell type (so-called GG,G1·G2, GFF, GF2, GF1, G1 F, etc.) can be cited.

The touch panel and the touch panel device of the present invention ispreferably an on-cell type, an OGS type, a TOL type, anotherconstitution, or various kinds of out-cell type in terms of the effectin improving framework visibility and improving taper visibility beingeasily exhibited.

The touch panel of the present invention and the touch panel displaydevice equipped with the touch panel of the present invention as aconstituent element may employ a constitution disclosed in “SaishinTacchipaneru Gijutsu” (Latest Touch Panel Technology) (published on 6thJuly 2009, Technotimes), edited by Yuji Mitani,“Tacchipaneru-no-gijutsu-to-kaihatsu” (Touch Panel Technology andDevelopment), CMC Publishing Co., Ltd. (2004, 12), FPD International2009 Forum T-11 Lecture Textbook, Cypress Semiconductor CorporationApplication Note AN2292, etc.

In accordance with the present invention, there can be provided a touchpanel member that is excellent in terms of suppression of visibility ofa transparent electrode and has low total reflection for visible light,and a touch panel and a touch panel display device having the touchpanel member.

EXAMPLES

The present invention is more specifically explained below by referenceto Examples. The materials, amounts used, proportions, processingdetails, processing procedures, etc. shown in the Examples below may bemodified as appropriate as long as the modifications do not depart fromthe spirit and scope of the present invention. Therefore, the scope ofthe present invention is not limited by the specific Examples shownbelow. ‘Parts’ and ‘%’ are on a mass basis unless otherwise specified.

Example 1 <Preparation of Transparent Substrate>

First, a 550 mm×650 mm glass plate (nonalkaline glass, NH Techno GlassCo,. Ltd., refractive index 1.53) was prepared as a transparentsubstrate, treated with a surfactant using ultrapure water, andsubsequently washed by an ultrasound washing treatment.

The transparent substrate was designed so as to produce 50 touch panelmember faces as follows, and any one face thereof was used in Example 1.

<Plate making for Lead-Out Wiring>

A 30 nm thick film of Ag—Pd—Cu alloy (APC) was formed on the entire faceof the glass substrate by sputtering as metal wiring for supplementingthe resistance of an outer peripheral wiring part. Subsequently, alead-out wiring pattern was formed in an area outside an active area bya photolithographic method using a positive photosensitive material (AZElectronic Materials). Furthermore, a mixed solution of phosphoric acid,nitric acid, and acetic acid was used as an etchant, unwanted parts wereremoved, and subsequently unwanted positive photosensitive material wasstripped using sodium hydroxide, thus forming a metal wiring pattern.

<Formation of Transparent Electrode Layer Film>

Subsequently, in order to form a transparent electrode layer above theface of the transparent substrate having the lead-out wiring formedthereon, an 80 nm thick film of ITO was formed on the entire face bysputtering. A transparent electrode layer comprising a predeterminedtouch sensor pattern was formed by a photolithographic method using thesame positive photosensitive material as for the lead-out wiring. Anoxalic acid-based solution was used as the etchant for ITO. When therefractive index of the transparent electrode layer thus formed wasmeasured by a spectroscopic ellipsometry method, the refractive indexwas 1.90 at 550 nm. When the taper angle was measured from an electronmicroscope photograph of a cross-section, it was 25°.

<Synthesis of Polymer P1>

A mixed solution of propylene glycol monomethyl ether acetate (PGM EA)(120 parts) and a total of 100 parts of tetrahydrofuran-2-ylmethacrylate (0.40 molar equivalents), methacrylic acid (0.10 molarequivalents), and (3-ethyloxetan-3-yl)methyl methacrylate (0.50 molarequivalents) was heated to 70° C. under a flow of nitrogen. This mixedsolution was added dropwise while stirring to a mixed solution of theradical polymerization initiator V-601 (dimethyl2,2′-azobis(2-methylpropionate), Wako Pure Chemical Industries, Ltd.,12.0 parts) and PGMEA (80 parts) over 3.5 hours. After the dropwiseaddition was completed, a reaction was carried out at 70° C. for 2hours, thus giving a PGMEA solution of polymer P1. PGMEA was furtheradded so as to adjust the solids content concentration to 40 mass %.

The weight-average molecular weight (Mw) of polymer P1 thus obtainedmeasured by gel permeation chromatography (GPC) was 15,000.

<Synthesis of Polymer P2>

In the same manner as for polymer P1, methacrylic acid (0.40 molarequivalents), glycidyl methacrylate (0.40 molar equivalents),dicyclopentanyl methacrylate (0.10 molar equivalents), and styrene (0.10molar equivalents) were copolymerized, thus giving a 40 mass % PGMEAsolution.

The weight-average molecular weight (Mw) of polymer P2 measured by gelpermeation chromatography (GPC) was 10,000.

<Preparation of Dispersion I> Formulation of Dispersion I

-   TTO-51 (C): titanium oxide particles (Ishihara Sangyo Kaisha Ltd.):    25 parts-   DISPERBYK-111 (dispersant, BYK-Chemie GmbH•Japan): 7.5 parts-   PGMEA (propylene glycol monomethyl ether acetate): 62.5 parts

A dispersion composition having the above formulation was dispersedusing an Ultra Apex Mill manufactured by Kotobuki Engineering andManufacturing Co., Ltd. by circulating for 150 min with a packing ratiofor 0.05 mm zirconia beads of 75% at a peripheral speed of 12 m/sec anda circulation flow rate of 180 g/min.

<Preparation of Positive-Working Photosensitive Resin Composition I: forFormation of Layer having Refractive Index of 1.90>

A uniform solution was formed by combining and mixing the formulationbelow and then subjected to filtration using a polyethylene filterhaving a pore size of 0.2 μm, thus giving positive-workingphotosensitive resin composition I.

Formulation

-   Propylene glycol monomethyl ether acetate (PGMEA): 32.4 parts-   Polymer P1 (solids content 40 mass % PGMEA solution): 12.0 parts-   Irgacure PAG-103 (photo-acid generator, BASF): 3.0 parts-   KBM-403 (silane coupling agent, Shin-Etsu Chemical Co., Ltd.): 2.0    parts-   CMTU (compound below, Toyo Kasei Kogyo Co., Ltd.): 0.3 parts-   Ftergent FTX-218 (surfactant, Neos Company Limited): 0.3 parts-   Cyclic thiourea compound below: 0.3 parts-   Dispersion I: 50.0 parts

<Preparation of Positive-Working Photosensitive Resin Composition II:for Formation of Layer having Refractive Index of 1.75>

A uniform solution was formed by combining and mixing the formulationbelow and then subjected to filtration using a polyethylene filterhaving a pore size of 0.2 μm, thus giving positive-workingphotosensitive resin composition II.

Formulation

-   Propylene glycol monomethyl ether acetate (PGMEA): 32.4 parts-   Polymer P1 (solids content 40 mass % PGMEA solution): 12.0 parts-   Irgacure PAG-103 (photo-acid generator, BASF): 3.0 parts-   KBM-403 (silane coupling agent, Shin-Etsu Chemical Co., Ltd.): 2.0    parts-   CMTU (compound above, Toyo Kasei Kogyo Co., Ltd.): 0.3 parts-   Ftergent FTX-218 (surfactant, Neos Company Limited): 0.3 parts-   Cyclic thiourea compound above: 0.3 parts-   Dispersion I: 32.0 parts    <Preparation of Positive-Working Photosensitive Resin Composition    III: for Formation of Layer having Refractive Index of 1.60>

A uniform solution was formed by combining and mixing the formulationbelow and then subjected to filtration using a polyethylene filterhaving a pore size of 0.2 μm, thus giving positive-workingphotosensitive resin composition III.

Formulation

-   Propylene glycol monomethyl ether acetate (PGMEA): 32.4 parts-   Polymer P1 (solids content 40 mass % PGMEA solution): 12.0 parts-   Irgacure PAG-103 (photo-acid generator, BASF): 3.0 parts-   KBM-403 (silane coupling agent, Shin-Etsu Chemical Co., Ltd.): 2.0    parts-   CMTU (compound above, Toyo Kasei Kogyo Co., Ltd.): 0.3 parts-   Ftergent FTX-218 (surfactant, Neos Company Limited): 0.3 parts-   Cyclic thiourea compound above: 0.3 parts-   Dispersion I: 13.0 parts

The substrate that had been subjected to film formation for thetransparent electrode layer was slit-coated with positive-workingphotosensitive resin composition I and dried at 90° C. for 2 minutes.The wiring parts of this film were exposed using an ultra high pressuremercury lamp, developed with a 0.7% aqueous solution of tetramethylammonium hydroxide (TMAH), and rinsed with pure, thus removing thecomposition layer for the lead-out wiring parts. It was further heatedin an oven at 200° C. for 30 minutes, thus giving a cured film layer(1st layer of the protective layer) above the transparent electrodelayer.

Separately, a cured film of positive-working photosensitive resincomposition I was obtained above a glass substrate in the same way as inthe step above, and when the refractive index was measured using a VASEspectroscopic ellipsometer (J. A. Woollam), it was 1.90 at a wavelengthof 550 nm.

The 1st layer was slit-coated with positive-working photosensitive resincomposition II, and dried at 90° C. for 2 minutes. The wiring parts ofthis film were exposed using an ultra high pressure mercury lamp,developed with a 0.7% aqueous solution of TMAH, and rinsed with pure,thus removing the composition layer for the lead-out wiring parts. Itwas further heated in an oven at 200° C. for 30 minutes, thus giving acured film layer (2nd layer) above the transparent electrode layer.

Separately, a cured film of positive-working photosensitive resincomposition II was obtained above a glass substrate in the same way asin the step above, and when the refractive index was measured using aVASE spectroscopic ellipsometer (J. A. Woollam), it was 1.75 at awavelength of 550 nm.

The 2nd layer was slit-coated with positive-working photosensitive resincomposition III and dried at 90° C. for 2 minutes. The wiring parts ofthis film were exposed using an ultra high pressure mercury lamp,developed with a 0.7% aqueous solution of TMAH, and rinsed with pure,thus removing the composition layer for the lead-out wiring parts. Itwas further heated in an oven at 200° C. for 30 minutes, thus giving acured film layer (3rd layer) above the transparent electrode layer.

Separately, a cured film of positive-working photosensitive resincomposition III was obtained above a glass substrate in the same way asin the step above, and when the refractive index was measured using aVASE spectroscopic ellipsometer (J. A. Woollam), it was 1.60 at awavelength of 550 nm.

<Measurement of Refractive Index>

An electron microscope photograph of a cross-section of the substratethat had been subjected to film formation of up to the 3rd layer (theNth layer) of the protective layer was taken, and the film thickness ofeach layer was measured. The film thickness of the transparent electrodelayer was 80 nm, the film thickness of the 1st layer was 0.60 μm, thefilm thickness of the 2nd layer was 0.70 μm, and the film thickness ofthe 3rd layer was 0.70 μm.

Furthermore, it was confirmed by X ray photoelectron spectrometry of across-section that each layer of the protective layer was a film inwhich titanium oxide particles were dispersed in an organic dispersionmedium. Furthermore, it was confirmed that the packing density oftitanium oxide particles was 1st layer>2nd layer>3rd layer. This made itpossible to estimate that the refractive index of the layers of theprotective layer was 1st layer>2nd layer>3rd layer. Based on thisinformation, the refractive index of each of the layers for light havinga wavelength of 550 nm was measured using a VASE spectroscopicellipsometer (J. A. Woollam). Fitting was carried out using a Cauchymodel.

The refractive index of the transparent electrode was 1.90, therefractive index of the 1st layer was 1.90, the refractive index of the2nd layer was 1.75, and the refractive index of the 3rd layer was 1.60.

Measurement of refractive index in the present invention was carried outas follows.

-   A. when a single film of each layer could be obtained, the single    film of each layer was measured using a spectroscopic ellipsometer.-   B. when a single film of each layer could not be obtained (when only    a layered film could be obtained), the layered film was measured    using a spectroscopic ellipsometer.

In this example, since both a single film and a layered film could beobtained, measurement was carried out by the two measurement methods,thus checking that there was no discrepancy between the two methods.

<Evaluation of Framework Visibility>

A substrate (touch panel member) that had been subjected to formation ofup to the 3rd layer (the Nth layer) was examined by eye under afluorescent lamp.

The evaluation criteria are shown below. A, B, and C are within apractical range.

-   A: electrode pattern could not be seen at all.-   B: at a distance of 20 cm or less from substrate, electrode pattern    was slightly visible, but could not be seen at 20 cm or greater.-   C: at a distance of 20 cm or greater from substrate, electrode    pattern was slightly visible.-   D: at a distance of 20 cm or greater from substrate, electrode    pattern could be seen clearly.

<Evaluation of Taper Visibility>

A substrate that had been subjected to formation of up to the 3rd layer(the Nth layer) was examined by eye while applying light obliquely usinga torch.

The evaluation criteria are shown below. A, B, and C are within apractical range.

-   A: light reflected from taper parts could not be seen at all.-   B: at a distance of 20 cm or less from substrate, light reflected    from taper parts was slightly visible, but could not be seen at 20    cm or greater.-   C: at a distance of 20 cm or greater from substrate, light reflected    from taper parts was slightly visible.-   D: at a distance of 20 cm or greater from substrate, light reflected    from taper parts could be seen clearly.

<Evaluation of Total Reflection>

A substrate that had been subjected to formation of up to the 3rd layer(the Nth layer) was placed on black paper and examined by eye underillumination with a white LED.

The evaluation criteria are shown below. A, B, and C are within apractical range.

-   A: whiteishness or glare could not be sensed at all.-   B: at a distance of 50 cm or less from substrate, slight impression    of whiteishness or glare, but could not be sensed at 20 cm or    greater.-   C: at a distance of 50 cm or greater from substrate, slight    impression of whiteishness or glare.-   D: at a distance of 50 cm or greater from substrate, strong    impression of whiteishness or glare.

<Evaluation of Pencil Hardness>

A substrate that had been subjected to formation of up to the 3rd layer(the Nth layer) was subjected to measurement of pencil hardness underthe conditions below.

-   Method: measured in accordance with JIS K 5600-5-4.-   Type of pencil: Uni, manufactured by Mitsubishi Pencil Co., Ltd.-   Load: 750 gw-   Angle: 45°-   Speed: 0.1 cm/sec-   Temperature: 25° C.

The evaluation result was 2H or greater (harder than 2H).

Example 2

<Preparation of Positive-Working Photosensitive Resin Composition IV:for Formation of Layer having Refractive Index of 1.80>

A uniform solution was formed by combining and mixing the formulationbelow and then subjected to filtration using a polyethylene filterhaving a pore size of 0.2 μm, thus giving positive-workingphotosensitive resin composition IV.

Formulation

-   Propylene glycol monomethyl ether acetate (PGMEA): 32.4 parts-   Polymer P1 (solids content 40 mass % PGMEA solution): 12.0 parts-   Irgacure PAG-103 (photo-acid generator, BASF): 3.0 parts-   KBM-403 (silane coupling agent, Shin-Etsu Chemical Co., Ltd.): 2.0    parts-   CMTU (compound above, Toyo Kasei Kogyo Co., Ltd.): 0.3 parts-   Ftergent FTX-218 (surfactant, Neos Company Limited): 0.3 parts-   Cyclic thiourea compound above: 0.3 parts-   Dispersion I: 37.5 parts    <Preparation of Positive-Working Photosensitive Resin Composition V:    for Formation of Layer having Refractive Index of 1.65>

A uniform solution was formed by combining and mixing the formulationbelow and then subjected to filtration using a polyethylene filterhaving a pore size of 0.2 μm, thus giving positive-workingphotosensitive resin composition V.

Formulation

-   Propylene glycol monomethyl ether acetate (PGMEA): 32.4 parts-   Polymer P1 (solids content 40 mass % PGMEA solution): 12.0 parts-   Irgacure PAG-103 (photo-acid generator, BASF): 3.0 parts-   KBM-403 (silane coupling agent, Shin-Etsu Chemical Co., Ltd.): 2.0    parts-   CMTU (compound above, Toyo Kasei Kogyo Co., Ltd.): 0.3 parts-   Ftergent FTX-218 (surfactant, Neos Company Limited): 0.3 parts-   Cyclic thiourea compound above: 0.3 parts-   Dispersion I: 19 parts    <Preparation of Positive-Working Photosensitive Resin Composition    VI: for Formation of Layer having Refractive Index of 1.53>

A uniform solution was formed by combining and mixing the formulationbelow and then subjected to filtration using a polyethylene filterhaving a pore size of 0.2 μm, thus giving positive-workingphotosensitive resin composition VI.

Formulation

-   Propylene glycol monomethyl ether acetate (PGMEA): 32.4 parts-   Polymer P1 (solids content 40 mass % PGMEA solution): 12.0 parts-   Irgacure PAG-103 (photo-acid generator, BASF): 3.0 parts-   KBM-403 (silane coupling agent, Shin-Etsu Chemical Co., Ltd.): 2.0    parts-   CMTU (compound above, Toyo Kasei Kogyo Co., Ltd.): 0.3 parts-   Ftergent FTX-218 (surfactant, Neos Company Limited): 0.3 parts-   Cyclic thiourea compound above: 0.3 parts

A substrate that had been subjected to film formation for thetransparent electrode layer as in Example 1 was slit-coated withpositive-working photosensitive resin composition IV and dried at 90° C.for 2 minutes. The wiring parts of this film were exposed using an ultrahigh pressure mercury lamp, developed with a 0.7% aqueous solution ofTMAH, and rinsed with pure, thus removing the composition layer for thelead-out wiring parts. It was further heated in an oven at 200° C. for30 minutes, thus giving a cured film layer (1st layer of the protectivelayer) above the transparent electrode layer.

The 1st layer of the protective layer was slit-coated withpositive-working photosensitive resin composition V and dried at 90° C.for 2 minutes. The wiring parts of this film were exposed using an ultrahigh pressure mercury lamp, developed with a 0.7% aqueous solution ofTMAH, and rinsed with pure, thus removing the composition layer for thelead-out wiring parts. It was further heated in an oven at 200° C. for30 minutes, thus giving a cured film layer (2nd layer of the protectivelayer) above the transparent electrode layer.

The 2nd layer of the protective layer was slit-coated withpositive-working photosensitive resin composition VI and dried at 90° C.for 2 minutes. The wiring parts of this film were exposed using an ultrahigh pressure mercury lamp, developed with a 0.7% aqueous solution ofTMAH, and rinsed with pure, thus removing the composition layer for thelead-out wiring parts. It was further heated in an oven at 200° C. for30 minutes, thus giving a cured film layer (3rd layer of the protectivelayer) above the transparent electrode layer.

In the same manner as in Example 1, the film thickness and therefractive index of each layer were measured using the layered film.

Furthermore, in the same manner as in Example 1, the pencil hardness ofthe Nth layer, framework visibility, taper visibility, and totalreflection were evaluated. The evaluation results are shown in Table 3.

Examples 3 to 20 and Comparative Examples 1 to 5

In Examples 3 to 20 and Comparative Examples 1 to 5, each of thecompositions shown in Table 1 and Table 2 was applied in the same manneras in Example 1, thus giving a layered protective layer.

The changes for each example are shown below.

In Example 4, after making lead-out wiring, before sputtering thetransparent electrode, sputtering was carried out with niobium oxide andsilicon oxide, thus forming a refractive index adjusting layer having afilm thickness of 30 nm and a refractive index of 1.90.

In Examples 5, 6, and 8, the transparent electrode was changed from ITOto IZO.

In Example 7, the ITO sputtering temperature was decreased slightly.

In Example 8, after making the lead-out wiring, before sputtering thetransparent electrode, niobium oxide and silicon oxide were sputtered,thus forming a refractive index adjusting layer having a film thicknessof 30 nm and a refractive index of 2.04.

In Examples 11, 15, and 18, when a negative composition was used, theexposure pattern was reversed from that for a positive composition.

In Examples 12 to 19, the sputtering time for the ITO transparentelectrode was changed so as to give a film thickness of 140 nm or 50 nm.

Furthermore, negative-working photosensitive resin compositions VII andVIII used are shown below.

<Preparation of Negative-Working Photosensitive Resin Composition VII:for Formation of Layer having Refractive Index of 1.75>

A uniform solution was formed by combining and mixing the formulationbelow and then subjected to filtration using a polyethylene filterhaving a pore size of 0.2 μm, thus giving negative-workingphotosensitive resin composition VII.

Formulation

-   Propylene glycol monomethyl ether acetate (PGMEA): 10 parts-   Polymer P2 (solids content 40 mass % PGMEA solution): 2.0 parts-   Dipentaerythritol hexaacrylate (Nippon Kayaku Co., Ltd.): 4.0 parts-   Aronix TO-2349 (carboxylic acid group-containing monomer, Toagosei    Co., Ltd.): 0.8 parts-   Irgacure OXE-01 (radical polymerization initiator, BASF): 2.0 parts-   KBM-5103 (silane coupling agent, Shin-Etsu Chemical Co., Ltd.): 1.0    parts-   Ftergent FTX-218 (surfactant, Neos Company Limited): 0.3 parts-   CMTU (compound above, Toyo Kasei Kogyo Co., Ltd.): 0.3 parts-   Cyclic thiourea compound above: 0.3 parts-   Dispersion I: 32.0 parts    <Preparation of Negative-Working Photosensitive Resin Composition    VIII: for Formation of Layer having Refractive Index of 1.60>

A uniform solution was formed by combining and mixing the formulationbelow and then subjected to filtration using a polyethylene filterhaving a pore size of 0.2 μm, thus giving negative-workingphotosensitive resin composition VIII.

Formulation

-   Propylene glycol monomethyl ether acetate (PGMEA): 10 parts-   Polymer P2 (solids content 40 mass % PGMEA solution): 2.0 parts-   Dipentaerythritol hexaacrylate (Nippon Kayaku Co., Ltd.): 4.0 parts-   Aronix TO-2349 (carboxylic acid group-containing monomer, Toagosei    Co., Ltd.): 0.8 parts-   Irgacure OXE-01 (radical polymerization initiator, BASF): 2.0 parts-   KBM-5103 (silane coupling agent, Shin-Etsu Chemical Co., Ltd.): 1.0    parts-   Ftergent FTX-218 (surfactant, Neos Company Limited): 0.3 parts-   NanoUse OZ-S3OK (zirconium oxide particle dispersion, Nissan    Chemical Industries Ltd.): 32.0 parts    <Preparation of Negative-Working Photosensitive Resin Composition    IX: for Formation of Layer having Refractive Index of 1.70>

A uniform solution was formed by combining and mixing the formulationbelow and then subjected to filtration using a polyethylene filterhaving a pore size of 0.2 μm, thus giving negative-workingphotosensitive resin composition IX.

Formulation

-   Propylene glycol monomethyl ether acetate (PGMEA): 10 parts-   Polymer P2 (solids content 40 mass % PGMEA solution): 2.0 parts-   Dipentaerythritol hexaacrylate (Nippon Kayaku Co., Ltd.): 4.0 parts-   Aronix TO-2349 (carboxylic acid group-containing monomer, Toagosei    Co., Ltd.): 0.8 parts-   Irgacure OXE-01 (radical polymerization initiator, BASF): 2.0 parts-   KBM-5103 (silane coupling agent, Shin-Etsu Chemical Co., Ltd.): 1.0    parts-   Ftergent FTX-218 (surfactant, Neos Company Limited): 0.3 parts-   CMTU (compound above, Toyo Kasei Kogyo Co., Ltd.): 0.3 parts-   Cyclic thiourea compound above: 0.3 parts-   Dispersion I: 25.0 parts    <Preparation of Negative-Working Photosensitive Resin Composition X:    for Formation of Layer having Refractive Index of 1.85>

The formulation below was combined, diethylene glycol ethyl methyl etherwas added so as to give a solids content concentration of 20%, andmixing was carried out to give a uniform solution that was thensubjected to filtration using a polyethylene filter having a pore sizeof 0.2 μm, thus giving negative-working photosensitive resin compositionX.

Formulation

-   Titanoxane (B-2, Nippon Soda Co., Ltd.): 76 parts-   Acetylacetone (Wako Pure Chemical Industries, Ltd.): 15 parts-   KAYARAD DPHA (mixture of dipentaerythritol hexaacrylate and    dipentaerythritol pentaacrylate, Nippon Kayaku Co., Ltd.): 6 parts-   Irgacure OXE-01 (BASF): 3 parts-   Megafac F-554 (surfactant, DIC): 0.1 parts    <Preparation of Negative-Working Photosensitive Resin Composition    XI: for Formation of Layer having Refractive Index of 1.75>

The formulation below was combined, diethylene glycol ethyl methyl etherwas added so as to give a solids content concentration of 15%, andmixing was carried out to give a uniform solution that was thensubjected to filtration using a polyethylene filter having a pore sizeof 0.2 μm, thus giving negative-working photosensitive resin compositionXI.

-   Zirconoxane (ZA-65, Matsumoto Fine Chemical Co., Ltd.): 60 parts-   Acetylacetone (Wako Pure Chemical Industries, Ltd.): 17 parts-   KAYARAD DPHA (Nippon Kayaku Co., Ltd.): 17 parts-   Irgacure OXE-01 (BASF): 3 parts-   Megafac F-554 (DIC): 0.1 parts    <Preparation of Negative-Working Photosensitive Resin Composition    XII: for Formation of Layer having Refractive Index of 1.65>

The formulation below was combined, diethylene glycol ethyl methyl etherwas added so as to give a solids content concentration of 15%, andmixing was carried out to give a uniform solution that was thensubjected to filtration using a polyethylene filter having a pore sizeof 0.2 μm, thus giving negative-working photosensitive resin compositionXII.

-   Zirconoxane (ZA-65, Matsumoto Fine Chemical Co., Ltd.): 30 parts-   Acetylacetone (Wako Pure Chemical Industries, Ltd.): 17 parts-   KAYARAD DPHA (Nippon Kayaku Co., Ltd.): 17 parts-   Irgacure OXE-01 (BASF): 3 parts-   Megafac F-554 (DIC): 0.1 parts

The film thickness and the refractive index of the transparent electrodelayer and each layer of the layered protective layer formed in each ofthe Examples and Comparative Example were measured.

Furthermore, the pencil hardness of the Nth layer of the substratehaving the layered protective film thus obtained, taper visibility,framework visibility, and total reflection were evaluated.

Example 21 Preparation of Touch Panel Display Device <Preparation ofTouch Panel>

In Example 18 described in JP-A-2014-71306, a layered film was formedusing, in order, the photosensitive resin compositions I, IV, II, V,III, and VI as a transparent protective layer (formation method was thesame as in Example 5.), thus giving a touch panel (front face plate)comprising the touch panel member of the present invention.

<Preparation of Touch Panel Display Device>

A liquid crystal display device produced by a method described inJP-A-2009-47936 was laminated with the front face plate, thus preparingby a known method a touch panel-equipped image display device comprisinga capacitance type input device as a constituent element.

As a result, good display properties as a touch panel were obtained.Furthermore, the transparent electrode pattern was not visible, and animage display device having excellent visibility suppression wasobtained.

Example 22 Preparation by Transfer Film

<Preparation of Negative-Working Photosensitive Resin Composition XIII:for Formation of Layer having Refractive Index of 1.51>

A uniform solution was formed by combining and mixing the formulationbelow and then subjected to filtration using a polyethylene filterhaving a pore size of 0.2 μm, thus giving negative-workingphotosensitive resin composition XIII.

Formulation

-   Propylene glycol monomethyl ether acetate (PGMEA): 27.1 parts-   Methyl ethyl ketone (MEK): 38.1 parts-   Polymer of structural formula below: 11.1 parts-   KAYARAD DPHA (Nippon Kayaku Co., Ltd.): 4.2 parts-   KAYARAD RP-1040 (pentaerythritol ethylene oxide adduct    tetraacrylate, Nippon Kayaku Co., Ltd.): 4.2 parts-   Irgacure 379 (radical polymerization initiator, BASF): 0.3 parts-   KAYACURE DETX-S (2,4-diethylthioxanthone, Nippon Kayaku Co., Ltd.):    0.3 parts-   Megafac F780 (surfactant, DIC): 0.01 parts

The molar ratio of the constituent units in the polymer wasx/w/y/z=46/2/20/32.

<Preparation of Negative-Working Photosensitive Resin Composition XIV:for Formation of Layer having Refractive Index of 1.65>

A uniform solution was formed by combining and mixing the formulationbelow and then subjected to filtration using a polyethylene filterhaving a pore size of 0.2 μm, thus giving negative-workingphotosensitive resin composition XIV.

Formulation

-   Propylene glycol monomethyl ether acetate (PGMEA): 37.6 parts-   Methyl ethyl ketone (MEK): 48.8 parts-   ZR-010 (zirconium oxide particle dispersion, Solar Co., Ltd.): 9.5    parts-   Polymer of structural formula below: 0.7 parts-   KAYARAD DPHA (Nippon Kayaku Co., Ltd.): 0.2 parts-   NK OLIGO UA-32P (urethane acrylate, Shin-Nakamura Chemical Co.,    Ltd.): 0.2 parts-   Viscoat #802 (mixture of tripentaerythritol acrylate,    dipentaerythritol acrylate, and tetrapentaerythritol acrylate (5- to    10-functional acrylate compound), Osaka Organic Chemical Industry    Ltd.): 0.4 parts-   Irgacure 379 (BASF): 0.1 parts-   KAYACURE DETX-S (Nippon Kayaku Co., Ltd.): 0.1 parts-   Megafac F780 (DIC): 0.01 parts

The numerical values at the bottom right of the brackets of eachconstituent unit of the polymer denote molar ratio.

<Formation of Transfer Film>

A temporary support, which was a 38 μm thick polyethylene terephthalatefilm, was coated using a slit-shaped nozzle with negative-workingphotosensitive resin composition XIII for formation of a layer having arefractive index of 1.51 at a film thickness of 5 μm, dried, thenirradiated with a UV lamp (exposure level 300 mJ/cm², metal halidelamp), thus forming a first curable transparent resin layer above thetemporary support.

Subsequently, the first curable transparent resin layer was coated withnegative-working photosensitive resin composition XIV for formation of alayer having a refractive index of 1.65 at a film thickness of 0.5 μm,dried, then irradiated with a UV lamp (exposure level 300 mJ/cm²,methane halide lamp), thus forming a second curable transparent resinlayer.

Subsequently, the second curable transparent resin layer was coated withpositive-working photosensitive resin composition IV for formation of alayer having a refractive index of 1.80 at a film thickness of 0.5 μmand dried, thus forming a third curable transparent resin layer.

<Compression Bonding of Protective Film>

A protective film (12 μm thick polypropylene film) was finallycompression-bonded onto the third curable transparent resin layer of thelayered body having the first curable transparent resin layer, thesecond curable transparent resin layer, and the third curabletransparent resin layer provided above the temporary support.

In this way, a transfer film was produced in which the temporarysupport, the first curable transparent resin layer, the second curabletransparent resin layer, the third curable transparent resin layer, andthe protective film were made into a unit.

<Transfer of Transfer Film onto Substrate>

The transfer film produced above was used, positions corresponding tolead-out wiring parts were cut out, the protective film was peeled off,and the third transparent curable resin layer (1st layer), the secondtransparent curable resin layer (2nd layer), the first transparentcurable resin layer (3rd layer), and temporary support were transferredin order onto a substrate that had been subjected to film formation ofup to the transparent electrode layer in the same manner as in Example 1(substrate temperature: 40° C., rubber roller temperature 110° C., linepressure 3 N/cm, transport speed 2 m/min).

Subsequently, the entire face was exposed from the temporary supportside at 100 mJ/cm² using i-line radiation from proximity type exposureequipment having an ultra high pressure mercury lamp (HitachiHigh-Technologies Corporation, Electronic Engineering). Subsequently,the temporary support was peeled off from the first transparent curableresin layer.

Subsequently, the substrate to which the first transparent curable resinlayer, the second transparent curable resin layer, and the thirdtransparent curable resin layer had been transferred was subjected to aheat treatment (post-baking) at 180° C. for 30 minutes, thus giving atouch panel member.

In the same manner as in Example 1, the film thickness and therefractive index of each layer were measured using the layered film.

Furthermore, In the same manner as in Example 1, the pencil hardness ofthe Nth layer, framework visibility, taper visibility, and totalreflection were evaluated. The evaluation results are shown in Table 3.

Table 1 shows the number of the photosensitive resin composition usedfor each layer of the protective layer, Table 2 shows details of thefilm thickness, the refractive index, etc., of the transparent electrodeand each layer of the protective layer, and Table 3 shows the evaluationresults.

TABLE 1 Protective layer First Second Third Fourth Fifth Sixth layerlayer layer layer layer layer Ex. 1 I II III — — — Ex. 2 IV V VI — — —Ex. 3 I IV II V III VI Ex. 4 I IV II V III VI Ex. 5 I IV II V III VI Ex.6 I II III — — — Ex. 7 IV III VI — — — Ex. 8 I II III — — — Ex. 9 I IIIII — — — Ex. 10 I II III VI — — Ex. 11 I VII VIII — — — Ex. 12 I II III— — — Ex. 13 I II III — — — Ex. 14 I IV II V III VI Ex. 15 I VII VIII —— — Ex. 16 I II III — — — Ex. 17 I IV II V III VI Ex. 18 I VII VIII — —— Ex. 19 I II III VI — — Ex. 20 X XI XII VIII VI — Ex. 22 IV XIV XIII —— — Comp. Ex. 1 I V VI — — — Comp. Ex. 2 I VI — — — — Comp. Ex. 3 V VI —— — — Comp. Ex. 4 I VI II — — — Comp. Ex. 5 I IX — — — —

TABLE 2 Transparent Protective layer electrode First layer Second layerThird layer Film Film Film Film thick- Refrac- Taper |n(elec- thick-Refrac- thick- Refrac- thick- Refrac- ness tive angle trode)- ness tiven(1)- ness tive n(2)- ness tive (nm) index (°) n(1)| (μm) index n(2)(μm) index n(3) (μm) index Ex. 1 80 1.90 25 0.00 0.60 1.90 0.15 0.701.75 0.15 0.70 1.60 Ex. 2 80 1.90 25 0.10 0.80 1.80 0.15 0.50 1.65 0.120.70 1.53 Ex. 3 80 1.90 25 0.00 0.50 1.90 0.10 0.30 1.80 0.05 0.30 1.75Ex. 4 80 1.90 25 0.00 0.50 1.90 0.10 0.30 1.80 0.05 0.30 1.75 Ex. 5 802.04 25 0.14 0.50 1.90 0.10 0.30 1.80 0.05 0.30 1.75 Ex. 6 80 2.04 250.14 0.60 1.90 0.15 0.70 1.75 0.15 0.70 1.60 Ex. 7 80 1.97 25 0.17 0.801.80 0.20 0.50 1.60 0.07 0.70 1.53 Ex. 8 80 2.04 25 0.14 0.60 1.90 0.150.70 1.75 0.15 0.70 1.60 Ex. 9 80 1.90 25 0.00 0.60 1.90 0.15 0.70 1.750.15 0.70 1.60 Ex. 10 80 1.90 25 0.00 0.60 1.90 0.15 0.70 1.75 0.15 0.701.60 Ex. 11 80 1.90 25 0.00 0.80 1.90 0.15 0.50 1.75 0.15 0.60 1.60 Ex.12 140 1.90 15 0.00 0.60 1.90 0.15 0.70 1.75 0.15 0.70 1.60 Ex. 13 1401.90 15 0.00 0.60 1.90 0.15 0.70 1.75 0.15 0.70 1.60 Ex. 14 140 1.90 150.00 0.50 1.90 0.10 0.30 1.80 0.05 0.30 1.75 Ex. 15 140 1.90 15 0.000.80 1.90 0.15 0.50 1.75 0.15 0.60 1.60 Ex. 16 50 1.90 45 0.00 0.60 1.900.15 0.70 1.75 0.15 0.70 1.60 Ex. 17 50 1.90 45 0.00 0.50 1.90 0.10 0.301.80 0.05 0.30 1.75 Ex. 18 50 1.90 45 0.00 0.80 1.90 0.15 0.50 1.75 0.150.60 1.60 Ex. 19 50 1.90 45 0.00 0.40 1.90 0.15 0.30 1.75 0.15 0.20 1.60Ex. 20 80 1.90 25 0.05 0.20 1.85 0.10 0.20 1.75 0.10 0.20 1.65 Ex. 22 801.90 25 0.10 0.50 1.80 0.15 0.50 1.65 0.14 5.00 1.51 Comp. Ex. 1 80 1.9025 0.00 0.60 1.90 0.25 0.50 1.65 0.12 0.70 1.53 Comp. Ex. 2 80 1.90 250.00 0.60 1.90 0.37 0.70 1.53 — — — Comp. Ex. 3 80 1.90 25 0.25 0.601.65 0.12 0.70 1.53 — — — Comp. Ex. 4 80 1.90 25 0.00 0.50 1.90 0.100.30 1.80 0.05 0.30 1.75 Comp. Ex. 5 80 1.90 25 0.00 0.80 1.90 0.20 0.701.70 — — — Protective layer Fourth layer Fifth layer Sixth layer NthFilm Film Film layer thick- Refrac- thick- Refrac- thick- Refrac- penciln(3)- ness tive n(4)- ness tive n(5)- ness tive n(1)- hard- n(4) (μm)index n(5) (μm) index n(6) (μm) index n(N) ness Ex. 1 — — — — — — — — —0.30 ≧2H Ex. 2 — — — — — — — — — 0.27 ≧2H Ex. 3 0.10 0.30 1.65 0.05 0.301.60 0.07 0.30 1.53 0.37 ≧2H Ex. 4 0.10 0.30 1.65 0.05 0.30 1.60 0.070.30 1.53 0.37 ≧2H Ex. 5 0.10 0.30 1.65 0.05 0.30 1.60 0.07 0.30 1.530.37 ≧2H Ex. 6 — — — — — — — — — 0.30 ≧2H Ex. 7 — — — — — — — — — 0.27≧2H Ex. 8 — — — — — — — — — 0.30 ≧2H Ex. 9 — — — — — — — — — 0.30 ≧2HEx. 10 0.07 0.70 1.53 — — — — — — 0.37 ≧2H Ex. 11 — — — — — — — — — 0.30≧2H Ex. 12 — — — — — — — — — 0.30 ≧2H Ex. 13 — — — — — — — — — 0.30 ≧2HEx. 14 0.10 0.30 1.65 0.05 0.30 1.60 0.07 0.30 1.53 0.37 ≧2H Ex. 15 — —— — — — — — — 0.30 ≧2H Ex. 16 — — — — — — — — — 0.30 ≧2H Ex. 17 0.100.30 1.65 0.05 0.30 1.60 0.07 0.30 1.53 0.37 ≧2H Ex. 18 — — — — — — — —— 0.30 ≧2H Ex. 19 0.07 0.20 1.53 — — — — — — 0.37 ≧2H Ex. 20 0.05 1.001.60 0.07 0.30 1.53 — — — 0.32 ≧2H Ex. 22 — — — — — — — — — 0.29 ≧2HComp. Ex. 1 — — — — — — — — — 0.37 ≧2H Comp. Ex. 2 — — — — — — — — —0.37 ≧2H Comp. Ex. 3 — — — — — — — — — 0.12 ≧2H Comp. Ex. 4 — — — — — —— — — 0.15 ≧2H Comp. Ex. 5 — — — — — — — — — 0.20 ≧2H

TABLE 3 Taper Framework Total visibility visibility reflection Ex. 1 A AB Ex. 2 A A B Ex. 3 A A A Ex. 4 A A A Ex. 5 B B A Ex. 6 B B B Ex. 7 C CC Ex. 8 B A B Ex. 9 A A B Ex. 10 A A B Ex. 11 A A B Ex. 12 A A B Ex. 13A A B Ex. 14 A A A Ex. 15 A A B Ex. 16 A A B Ex. 17 A A A Ex. 18 A A BEx. 19 A A B Ex. 20 A A A Ex. 22 A A B Comp. Ex. 1 A A D Comp. Ex. 2 A AD Comp. Ex. 3 D D D Comp. Ex. 4 A A D Comp. Ex. 5 A A D

What is claimed is:
 1. A touch panel member comprising, in order, atleast a transparent substrate, a transparent electrode, and a protectivelayer provided so as to cover the transparent electrode, the protectivelayer comprising three or more layers having different refractiveindices, all of the different refractive index layers of the protectivelayer satisfying Expression 1, and the protective layer satisfyingExpression 2 and Expression 3 below0<n(x)−n(x+1)≦0.20   (1)|n(electrode)−n(1)|≦0.20   (2)0.20≦n(1)−n(N)   (3) wherein in the expressions, among the differentrefractive index layers in the protective layer, the layer that isclosest to the transparent electrode is designated as the 1st layer,then the 2nd layer, and so on, and the layer that is farthest from thetransparent substrate is designated as the Nth layer, the refractiveindex of an ath layer of the protective layer is defined as n(a), adenotes an integer satisfying 1≦a≦N, x denotes an integer satisfying1≦x≦N−1, and the refractive index of the transparent electrode isdefined as n(electrode).
 2. The touch panel member according to claim 1,wherein the face of the transparent substrate on which the transparentelectrode is provided and the side face of the transparent electrodeform a taper angle of 2° to 80°.
 3. The touch panel member according toclaim 1, wherein the transparent electrode has a refractive index of atleast 1.76 but no greater than 2.30.
 4. The touch panel member accordingto claim 3, wherein the transparent electrode has a refractive index ofat least 1.86 but no greater than 2.20.
 5. The touch panel memberaccording to claim 1, wherein the transparent electrode comprises indiumtin oxide or indium zinc oxide.
 6. The touch panel member according toclaim 1, wherein all of the 1st layer to the N-1th layer in theprotective layer are layers comprising an inorganic material and anorganic material.
 7. The touch panel member according to claim 1,wherein all of the 1st layer to the Nth layer in the protective layercomprise a polymer.
 8. The touch panel member according to claim 1,wherein all of the 1st layer to the N-1th layer in the protective layerare layers comprising a compound selected from the group consisting of atitanoxane, a zirconoxane, a titanoxane-zirconoxane condensationproduct, titanium oxide, zirconium oxide, and a titanium-zirconiumcomposite oxide.
 9. The touch panel member according to claim 8, whereinwith regard to the 1st layer to the N-1th layer in the protective layer,the content of the compound selected from the group consisting of atitanoxane, a zirconoxane, a titanoxane-zirconoxane condensationproduct, titanium oxide, zirconium oxide, and a titanium-zirconiumcomposite oxide decreases as the layer number increases.
 10. The touchpanel member according to claim 8, wherein all of the 1st layer to theN-1th layer in the protective layer are layers comprising titanium oxideparticles, zirconium oxide particles, and/or titanium-zirconiumcomposite oxide particles.
 11. A touch panel comprising the touch panelmember according to claim
 1. 12. A touch panel display device comprisingthe touch panel member according to claim 1.